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LM3668 Arkusz danych(PDF) 4 Page - Texas Instruments |
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LM3668 Arkusz danych(HTML) 4 Page - Texas Instruments |
4 / 30 page LM3668 SNVS449O – JUNE 2007 – REVISED APRIL 2015 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT PVIN, VDD, SW1, SW2 & VOUT pins: voltage to SGND & PGND –0.2 6 V FB, EN, and MODE/SYNC pins (PGND and SGND-0.2) (PVIN + 0.2) V PGND to SGND –0.2 0.2 V Continuous power dissipation(3) Internally Limited Maximum junction temperature (TJ-MAX) 125 °C Maximum lead temperature (soldering, 10 sec) 260 °C Storage temperature , Tstg –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. (3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125ºC), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX). 7.2 ESD Ratings VALUE UNIT Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2500 V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC specification JESD22- ±1250 C101(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions MIN MAX UNIT Input voltage 2.5 5.5 V Recommended load current 0 1 A Junction temperature (TJ) −40 125 °C Ambient temperature (TA) (1) −40 85 °C (1) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125ºC), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX). 4 Submit Documentation Feedback Copyright © 2007–2015, Texas Instruments Incorporated Product Folder Links: LM3668 |
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