LM3668

SNVS449O – JUNE 2007 – REVISED APRIL 2015

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7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

PVIN, VDD, SW1, SW2 & VOUT pins: voltage to SGND & PGND

–0.2

6

V

FB, EN, and MODE/SYNC pins

(PGND and SGND-0.2)

V

PGND to SGND

–0.2

0.2

V

Internally Limited

125

°C

Maximum lead temperature (soldering, 10 sec)

260

°C

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(3)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

7.2 ESD Ratings

VALUE

UNIT

±2500

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-

±1250

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

MIN

MAX

UNIT

Input voltage

2.5

5.5

V

Recommended load current

0

1

A

−40

125

°C

(1)

−40

85

°C

(1)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

4

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