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UC1834-DIE Arkusz danych(PDF) 2 Page - Texas Instruments |
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UC1834-DIE Arkusz danych(HTML) 2 Page - Texas Instruments |
2 / 6 page UC1834-DIE SLOS898 – NOVEMBER 2014 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 4 Bare Die Information BACKSIDE BOND PAD METALLIZATION DIE THICKNESS BACKSIDE FINISH BOND PAD THICKNESS POTENTIAL COMPOSITION 10.5 mils Silicon with backgrind Floating AlCu2% 2000 nm 2 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Product Folder Links: UC1834-DIE |
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