LC786960E

No.A2080-4/24

Specifications

Absolute Maximum Ratings

at Ta = 25

C, DVSS = AVSS = LRVSS = XVSS1 = XVSS2 = VVSS1 = VVSS2 = 0V

Parameter

Symbol

Pin names

Conditions

Ratings

Unit

Maximum supply voltage

VDD max

DVDD, AVDD, LRVDD, XVDD1,

XVDD2, UVDD, VVDD1, VVDD2,

VVDD3

-0.3 to +3.95

V

Input voltage 1

VIN1

Input pins other than VIN2

-0.3 to DVDD+0.3

V

Input voltage 2

VIN2

RESB, SIFCK, SIFDI, SIFDO,

SIFCE, BUSYB, GP03, GP04,

GP05, GP06, GP07, GP10,

GP11, GP12, JTRSTB, JTCK,

JTDI, JTMS

-0.3 to +5.6

V

Output voltage

VOUT

-0.3 to DVDD+0.3

V

Allowable power dissipation

Pd max

Ta

 85C

Mounted reference PCB (*)

519

mW

Operating temperature

Topr

-40 to +85

C

Storage temperature

Tstg

-40 to +125

C

(*)Reference PCB: 114.3mm×76.1mm×1.6mm, glass epoxy resin

Allowable Operating Ranges

at Ta = -40 to +85

C,

DVSS = AVSS = LRVSS = XVSS1 = XVSS2 = VVSS1 = VVSS2 = 0V

Parameter

Symbol

Pin names

Conditions

min

typ

max

Unit

Supply voltage

VDD1

DVDD, AVDD, LRVDD, XVDD1,

XVDD2, UVDD, VVDD1, VVDD2,

VVDD3

3.00

3.60

V

High-level input voltage

VIH(1)

RESB, SIFCK, SIFDI,

SIFDO, SIFCE, BUSYB,

GP03, GP04, GP05, GP06,

GP07, GP10, GP11, GP12,

JTMS, JTRSTB, JTCK, JTDI

Schmitt

2.00

5.50

V

VIH(2)

GP13, GP30, GP31, GP32,

GP33, GP34, GP35, GP36,

GP37, GP43, GP44, GP45,

GP50, GP51, GP52, GP53

Schmitt

2.00

VDD1V

Low-level input voltage

VIL(1)

RESB, SIFCK, SIFDI,

SIFDO, SIFCE, BUSYB,

GP03, GP04, GP05, GP06,

GP07, GP10, GP11, GP12,

JTMS, JTRSTB, JTCK, JTDI

Schmitt

0

0.80

V

VIL(2)

GP13, GP30, GP31, GP32,

GP33, GP34, GP35, GP36,

GP37, GP43, GP44, GP45,

GP50, GP51, GP52, GP53,

MODE0, MODE1, MODE2

Schmitt

0

0.80

V

Crystal oscillator frequency

FX1

XIN

Oscillator circuit

12.0

MHz

XOUT

FX2

X16IN

Oscillator circuit

16.9344

MHz

X16OUT

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating

Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.