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TMP302 Arkusz danych(PDF) 4 Page - Texas Instruments |
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TMP302 Arkusz danych(HTML) 4 Page - Texas Instruments |
4 / 21 page TMP302 SBOS488C – JUNE 2009 – REVISED AUGUST 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Supply 3.6 Voltage Input pin (TRIPSET0, TRIPSET1, HYSTSET) –0.5 VS + 0.5 V Output pin (OUT) –0.5 3.6 Current Output pin (OUT) 10 mA Operating –55 130 Temperature Junction 150 °C Storage, Tstg –60 150 (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6.2 ESD Ratings VALUE UNIT Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V(ESD) Electrostatic discharge Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000 V Machine model (MM) ±500 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VS Power supply voltage 1.4 3.3 3.6 V Rpullup Pullup resistor connected from OUT to VS 10 100 k Ω TA Specified temperature range –40 125 °C 6.4 Thermal Information TMP302 THERMAL METRIC(1) DRL (SOT) UNIT 6 PINS RθJA Junction-to-ambient thermal resistance 200 °C/W RθJC(top) Junction-to-case (top) thermal resistance 73.7 °C/W RθJB Junction-to-board thermal resistance 34.4 °C/W ψJT Junction-to-top characterization parameter 3.1 °C/W ψJB Junction-to-board characterization parameter 34.2 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2009–2015, Texas Instruments Incorporated Product Folder Links: TMP302 |
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