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TMP302C-Q1 Arkusz danych(PDF) 11 Page - Texas Instruments |
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TMP302C-Q1 Arkusz danych(HTML) 11 Page - Texas Instruments |
11 / 18 page TRIPSET0 TRIPSET1 GND OUT VS HYSTSET Heat Source 0.1 µF VIA to Power Ground Plane Ground Plane for Thermal Coupling to Heat Source Supply Voltage Output 10 k TMP302-Q1 www.ti.com SLOS889B – OCTOBER 2014 – REVISED JULY 2015 10 Power Supply Recommendations The TMP302-Q1 family of devices is designed to operate from a single power supply within the range 1.4 V and 3.6 V. No specific power supply sequencing with respect to any of the input or output pins is required. The TMP302-Q1 family of devices is fully functional within 35 ms of the voltage at the VS pin reaching or exceeding 1.4 V. 11 Layout 11.1 Layout Guidelines Place the power supply bypass capacitor as close as possible to the VS and GND pins. The recommended value for this bypass capacitor is 0.1-µF. Additional bypass capacitance can be added to compensate for noisy or high- impedance power supplies. Place a 10-k Ω pullup resistor from the open drain OUT pin to the power supply pin VS. 11.2 Layout Example Figure 14. Layout Example Copyright © 2014–2015, Texas Instruments Incorporated Submit Documentation Feedback 11 Product Folder Links: TMP302-Q1 |
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