MTV32N25E

http://onsemi.com

2

Rating

Symbol

Value

Unit

Drain−Source Voltage

250

Vdc

250

Vdc

Gate−Source Voltage — Continuous

±20

Vdc

Drain Current — Continuous

32

25

96

Adc

Apk

Total Power Dissipation @ 25°C

Derate above 25°C

250

2.0

3.57

Watts

W/°C

Watts

Operating and Storage Temperature Range

−55 to 150

°C

600

mJ

Thermal Resistance — Junction to Case

0.5

62.5

35

°C/W

Maximum Temperature for Soldering Purposes, 1/8″ from case for 10 seconds

260

°C

(1) When surface mounted to an FR4 board using the minimum recommended pad size.

Designer’s Data for “Worst Case” Conditions — The Designer’s Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit

curves — representing boundaries on device characteristics — are given to facilitate “worst case” design.