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TPA2025D1YZGT Arkusz danych(PDF) 4 Page - Texas Instruments |
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4 / 29 page TPA2025D1 SLOS717B – AUGUST 2011 – REVISED DECEMBER 2014 www.ti.com 8 Specifications 8.1 Absolute Maximum Ratings Over operating free–air temperature range, TA= 25°C (unless otherwise noted) (1) MIN MAX UNIT Supply voltage VBAT –0.3 6 V Input Voltage, VI IN+, IN– –0.3 VBAT + 0.3 V Output continuous total power dissipation See Thermal Information Operating free-air temperature range, TA –40 85 °C Operating junction temperature range, TJ –40 150 °C Minimum load resistance 3.2 Ω Maximum input voltage swing EN = 0 V 2 VRMS Storage temperature range, Tstg –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability. 8.2 ESD Ratings VALUE UNIT Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 Charged-device model (CDM), per JEDEC specification JESD22- ±500 V(ESD) Electrostatic discharge V C101(2) Machine model (MM) ±100 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 8.3 Recommended Operating Conditions MIN MAX UNIT Supply voltage, VBAT 2.5 5.2 V VIH High–level input voltage, EN 1.3 V VIL Low–level input voltage, EN 0.6 V TA Operating free-air temperature –40 85 °C TJ Operating junction temperature –40 150 °C 8.4 Thermal Information TPA2025D1 THERMAL METRIC(1) YZG UNITS 12 PINS RθJA Junction-to-ambient thermal resistance 97.3 RθJC(top) Junction-to-case(top) thermal resistance 36.7 RθJB Junction-to-board thermal resistance 55.9 °C/W ψJT Junction-to-top characterization parameter 13.9 ψJB Junction-to-board characterization parameter 49.5 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2011–2014, Texas Instruments Incorporated Product Folder Links: TPA2025D1 |
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