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TPA6211A1DGNR Arkusz danych(PDF) 4 Page - Texas Instruments |
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4 / 37 page TPA6211A1 SLOS367E – AUGUST 2003 – REVISED NOVEMBER 2015 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range unless otherwise noted (1) MIN MAX UNIT VD Supply voltage –0.3 6 V D VI Input voltage –0.3 VDD + 0.3 V Continuous total power dissipation See Dissipation Ratings TA Operating free-air temperature –40 85 °C TJ Junction temperature –40 150 °C Tstg Storage temperature –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.2 ESD Ratings VALUE UNIT Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±4000 V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC specification JESD22- ±1000 C101(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operation Conditions MIN NOM MAX UNIT VDD Supply voltage 2.5 5.5 V VIH High-level input voltage SHUTDOWN 1.55 V VIL Low-level input voltage SHUTDOWN 0.5 V TA Operating free-air temperature –40 85 °C 7.4 Thermal Information TPA6211A1 DGN (MSOP- DRB (SON) THERMAL METRIC(1) UNIT PowerPAD™) 8 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 62.8 49.2 °C/W RθJC(top) Junction-to-case (top) thermal resistance 61.9 24.8 °C/W RθJB Junction-to-board thermal resistance 42.1 58.8 °C/W ψJT Junction-to-top characterization parameter 3.3 1.7 °C/W ψJB Junction-to-board characterization parameter 41.9 25 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 11 8.4 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 7.5 Electrical Characteristics TA = 25°C PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Output offset voltage (measured VOS VI = 0 V differential, Gain = 1 V/V, VDD = 5.5 V -9 0.3 9 mV differentially) PSRR Power supply rejection ratio VDD = 2.5 V to 5.5 V –85 –60 dB VIC Common mode input range VDD = 2.5 V to 5.5 V 0.5 VDD-0.8 V 4 Submit Documentation Feedback Copyright © 2003–2015, Texas Instruments Incorporated Product Folder Links: TPA6211A1 |
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