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SL23EP05SI-1HT Arkusz danych(PDF) 8 Page - Silicon Laboratories |
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SL23EP05SI-1HT Arkusz danych(HTML) 8 Page - Silicon Laboratories |
8 / 15 page SL23EP05 8 Rev. 2.2 Table 6. Thermal Characteristics Parameter Symbol Test Condition Min Typ Max Unit Thermal Resistance Junction to Ambient Still air — 110 — °C/W 1 m/s air flow — 100 — °C/W 3 m/s air flow — 80 — °C/W Thermal Resistance Junction to Case Independent of air flow — 35 — °C/W Table 7. Absolute Maximum Rating Parameter Test Condition Min Max Unit Supply voltage, VDD –0.5 4.6 V All Inputs and Outputs –0.5 VDD+0.5 V Ambient Operating Temperature In operation, C-Grade 0 70 °C Ambient Operating Temperature In operation, I-Grade –40 85 °C Storage Temperature No power is applied –65 150 °C Junction Temperature In operation, power is applied — 125 °C Soldering Temperature — 260 °C ESD Rating (Human Body Model) JEDECC22-A114D –4000 4000 V ESD Rating (Charge Device Model) JEDECC22-C101C –1500 1500 V ESD Rating (Machine Model) JEDECC22-A115D –200 200 V |
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