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DAC8812

SBAS349D – AUGUST 2005 – REVISED JANUARY 2016

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Copyright © 2005–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7 Specifications

7.1 Absolute Maximum Ratings

over operating ambient temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

–0.3

7

V

–18

18

V

Digital logic inputs to GND

–0.3

V

–0.3

V

–0.3

0.3

V

Input current to any pin except supplies

–50

50

mA

Package power dissipation

W

150

°C

Operating temperature

–40

85

°C

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Pins listed as ±4000

V may actually have higher performance.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Pins listed as ±1000

V may actually have higher performance.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±4000

V

Charged-device model (CDM), per JEDEC specification JESD22-

±1000

7.3 Recommended Operating Conditions

over operating ambient temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage to GND

2.7

5.5

V

Operating ambient temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

7.4 Thermal Information

DAC8812

UNIT

PW (TSSOP)

16 PINS

Junction-to-ambient thermal resistance

100.6

°C/W

Junction-to-case (top) thermal resistance

32.8

°C/W

Junction-to-board thermal resistance

46.8

°C/W

Junction-to-top characterization parameter

2

°C/W

Junction-to-board characterization parameter

46

°C/W