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TPL5000 Arkusz danych(PDF) 4 Page - Texas Instruments

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Numer części TPL5000
Szczegółowy opis  Nano-Power Programmable Timer
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TPL5000
SNAS628B – JULY 2013 – REVISED DECEMBER 2014
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature (unless otherwise noted)
(1)
MIN
MAX
UNIT
Supply Voltage
–0.3
6.0
V
Input Voltage(2)
–0.3
VDD + 0.3
V
Voltage between any two pins
VDD + 0.3
V
Input Current on any pin
–5
5
mA
Operating Temperature, TA
–40
105
Junction Temperature, TJ
(3)
150
°C
Storage Temperature, Tstg
–65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
When the input voltage (VIN) at any pin exceeds the power supply (VDD), the current on that pin must not exceed 5 mA and must not
exceed 6.0 V.
(3)
The maximum power dissipation is a function of TJ(MAX), RθJA, and the ambient temperature, TA. The maximum allowable power
dissipation at any ambient temperature is PDMAX = (TJ(MAX) - TA)/ θJA. All numbers apply for packages soldered directly onto a PCB.
7.2 ESD Ratings
VALUE
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V(ESD)
Electrostatic discharge
V
Charged-device model (CDM), per JEDEC specification JESD22-
±500
C101(2)
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Ratings
MIN
MAX
UNIT
Supply Voltage (VDD-GND)
1.8
5.0
V
Temperature Range
-40
105
°C
7.4 Thermal Information
TPL5000
THERMAL METRIC(1)
VSSOP
UNIT
10 PINS
RθJA
Junction-to-ambient thermal resistance
196.8
°C/W
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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