ADS7044

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SBAS682D – NOVEMBER 2014 – REVISED DECEMBER 2015

6 Specifications

6.1 Absolute Maximum Ratings

(1)

MIN

MAX

UNIT

AVDD to GND

–0.3

3.9

V

DVDD to GND

–0.3

3.9

V

AINP to GND

–0.3

AVDD + 0.3

V

AINM to GND

–0.3

AVDD + 0.3

V

Digital input voltage to GND

–0.3

DVDD + 0.3

V

–60

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic discharge

V

±1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

AVDD

Analog supply voltage range

1.65

3.6

V

DVDD

Digital supply voltage range

1.65

3.6

V

Operating free-air temperature

–40

125

°C

6.4 Thermal Information

ADS7044

RUG (X2QFN)

DCU (VSSOP)

UNIT

8 PINS

8 PINS

Junction-to-ambient thermal resistance

177.5

235.8

°C/W

Junction-to-case (top) thermal resistance

51.5

79.8

°C/W

Junction-to-board thermal resistance

76.7

117.6

°C/W

Junction-to-top characterization parameter

1.0

8.9

°C/W

Junction-to-board characterization parameter

76.7

116.5

°C/W

Junction-to-case (bottom) thermal resistance

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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