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DAC7562SDGST Arkusz danych(PDF) 5 Page - Texas Instruments |
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DAC7562SDGST Arkusz danych(HTML) 5 Page - Texas Instruments |
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5 / 60 page  DAC7562, DAC7563, DAC8162 DAC8163, DAC8562, DAC8563 www.ti.com SLAS719E – AUGUST 2010 – REVISED JUNE 2015 7 Specifications 7.1 Absolute Maximum Ratings (1) Over operating ambient temperature range (unless otherwise noted). MIN MAX UNIT AVDD to GND –0.3 6 V CLR, DIN, LDAC, SCLK and SYNC input voltage to GND –0.3 AVDD + 0.3 V VOUT[A, B] to GND –0.3 AVDD + 0.3 V VREFIN/VREFOUT to GND –0.3 AVDD + 0.3 V Operating temperature range –40 125 °C Junction temperature, TJ 150 °C Storage temperature, Tstg –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.2 ESD Ratings VALUE UNIT Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±1000 V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC specification JESD22- ±500 C101(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating ambient temperature range (unless otherwise noted) MIN NOM MAX UNIT POWER SUPPLY Supply voltage AVDD to GND 2.7 5.5 V DIGITAL INPUTS Digital input voltage CLR, DIN, LDAC, SCLK and SYNC 0 AVDD V REFERENCE INPUT VREFIN Reference input voltage 0 AVDD V TEMPERATURE RANGE TA Operating ambient temperature –40 125 °C 7.4 Thermal Information DAC756x, DAC816x, DAC856x THERMAL METRIC DSC (WSON) DGS (VSSOP) UNIT 10 PINS 10 PINS RθJA Junction-to-ambient thermal resistance 62.8 173.8 °C/W RθJC(top) Junction-to-case (top) thermal resistance 44.3 48.5 °C/W RθJB Junction-to-board thermal resistance 26.5 79.9 °C/W ψJT Junction-to-top characterization parameter 0.4 1.7 °C/W ψJB Junction-to-board characterization parameter 25.5 68.4 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 46.2 N/A °C/W Copyright © 2010–2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: DAC7562 DAC7563 DAC8162 DAC8163 DAC8562 DAC8563 |
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