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SN74AVC32T245 Arkusz danych(PDF) 7 Page - Texas Instruments |
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SN74AVC32T245 Arkusz danych(HTML) 7 Page - Texas Instruments |
7 / 29 page SN74AVC32T245 www.ti.com SCES553F – MAY 2004 – REVISED JULY 2015 6.3 Recommended Operating Conditions See (1) (2) (3) VCCI VCCO MIN MAX UNIT VCCA Supply voltage 1.2 3.6 V VCCB Supply voltage 1.2 3.6 V 1.2 V to 1.95 V VCCI × 0.65 VIH High-level input voltage Data inputs(4) 1.95 V to 2.7 V 1.6 V 2.7 V to 3.6 V 2 1.2 V to 1.95 V VCCI × 0.35 VIL Low-level input voltage Data inputs(4) 1.95 V to 2.7 V 0.7 V 2.7 V to 3.6 V 0.8 1.2 V to 1.95 V VCCA × 0.65 DIR VIH High-level input voltage 1.95 V to 2.7 V 1.6 V (referenced to VCCA) (5) 2.7 V to 3.6 V 2 1.2 V to 1.95 V VCCA × 0.35 DIR VIL Low-level input voltage 1.95 V to 2.7 V 0.7 V (referenced to VCCA) (5) 2.7 V to 3.6 V 0.8 VI Input voltage 0 3.6 V Active state 0 VCCO VO Output voltage V 3-state 0 3.6 1.2 V –3 1.4 V to 1.6 V –6 IOH High-level output current 1.65 V to 1.95 V –8 mA 2.3 V to 2.7 V –9 3 V to 3.6 V –12 1.2 V 3 1.4 V to 1.6 V 6 IOL Low-level output current 1.65 V to 1.95 V 8 mA 2.3 V to 2.7 V 9 3 V to 3.6 V 12 Δt/Δv Input transition rise or fall rate 5 ns/V TA Operating free-air temperature –40 85 °C (1) VCCI is the VCC associated with the data input port. (2) VCCO is the VCC associated with the output port. (3) All unused data inputs of the device must be held at VCCI or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. (4) For VCCI values not specified in the data sheet, VIH min = VCCI × 0.7 V, VIL max = VCCI × 0.3 V. (5) For VCCI values not specified in the data sheet, VIH min = VCCA × 0.7 V, VIL max = VCCA × 0.3 V. 6.4 Thermal Information SN74AVC32T245 ZRL GKE/ZKE THERMAL METRIC(1) (MICROSTAR UNIT (LFBGA) JUNIOR) 96 PINS 96 PINS RθJA Junction-to-ambient thermal resistance 70.7 105.8 °C/W RθJC(top) Junction-to-case (top) thermal resistance 34.0 1.6 °C/W RθJB Junction-to-board thermal resistance 43.5 10.8 °C/W ψJT Junction-to-top characterization parameter 3.5 3.1 °C/W ψJB Junction-to-board characterization parameter 43.5 10.8 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. Copyright © 2004–2015, Texas Instruments Incorporated Submit Documentation Feedback 7 Product Folder Links: SN74AVC32T245 |
Podobny numer części - SN74AVC32T245_15 |
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Podobny opis - SN74AVC32T245_15 |
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