See mechanical drawings for dimensions.

DBV PACKAGE

(TOP VIEW)

2

GND

V

CC

5

3

4

B

Y

6

1

A

C

DCK PACKAGE

(TOP VIEW)

3

4

B

2

GND

Y

5

1

A

V

CC

6

C

DRY PACKAGE

(TOP VIEW)

GND

V

CC

A

6

5

4

2

3

B

Y

C

1

YZP PACKAGE

(BOTTOM VIEW)

GND

V

CC

A

B

2

1

3

Y

5

4

6

C

A

B

DSF PACKAGE

(TOP VIEW)

GND

C

Y

V

CC

6

5

4

2

3

1

SN74LVC1G386

www.ti.com

SCES439E – APRIL 2003 – REVISED DECEMBER 2013

Single 3-Input Positive-XOR Gate

Check for Samples: SN74LVC1G386

1

FEATURES

DESCRIPTION

The SN74LVC1G386 device performs the Boolean

2

•

Available in the Texas Instruments

function Y = A × B × C in positive logic.

NanoStar ™ and NanoFree™

Packages

NanoStar™ and NanoFree™ package technology is

a major breakthrough in IC packaging concepts,

•

using the die as the package.

•

Inputs Accept Voltages to 5.5 V

This device is fully specified for partial-power-down

•

•

outputs,

preventing

damaging

current

backflow

Down Mode, Back-Drive Protection

through the device when it is powered down.

•

Latch-Up Performance Exceeds 100 mA

Per JESD 78, Class II

•

ESD Protection Exceeds JESD 22

–

2000-V Human-Body Model (A114-A)

–

200-V Machine Model (A115-A)

–

1000-V Charged-Device Model (C101)

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2

NanoStar, NanoFree are trademarks of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Copyright © 2003–2013, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.