LM21215A

SNOSB87C – MARCH 2011 – REVISED JANUARY 2016

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6 Specifications

6.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

−0.3

6

V

−0.3

V

EN, FB, COMP, PGOOD, SS/TRK to GND

−0.3

V

−65

150

ºC

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(3)

The PVIN prin can tolerate transient voltages up to 6.5 V for a duration of up to 6 ns. These transients can occur during normal

operation of the device.

(4)

The SW pin can tolerate transient voltages up to 9 V for a duration of 6 ns and –1 V for a duration of 4 ns. These transients can occur

during normal operation of the device.

6.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic discharge

V

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

Over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Input voltages

PVIN, AVIN to GND

2.95

5.5

V

−0.3

15

A

−40

125

ºC

6.4 Thermal Information

LM21215A -1

PWP (HTSSOP)

UNIT

20 PINS

Junction-to-ambient thermal resistance

30.5

°C/W

Junction-to-case (top) thermal resistance

12.9

°C/W

Junction-to-board thermal resistance

0.3

°C/W

Junction-to-top characterization parameter

0.3

°C/W

Junction-to-board characterization parameter

2.3

°C/W

Junction-to-case (bottom) thermal resistance

0

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

4

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