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LM3262TMX Arkusz danych(PDF) 11 Page - Texas Instruments |
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LM3262TMX Arkusz danych(HTML) 11 Page - Texas Instruments |
11 / 41 page LM3262 www.ti.com SNVS875O – AUGUST 2012 – REVISED DECEMBER 2015 7 Detailed Description 7.1 Overview The LM3262 is a simple, step-down DC-DC converter optimized for powering RF power amplifiers (PAs) in mobile phones, portable communicators, and similar battery powered RF devices. It is designed to allow the RF PA to operate at maximum efficiency over a wide range of power levels from a single li-ion battery cell. The device is based on a voltage-mode buck architecture, with synchronous rectification for high efficiency. It is designed for a maximum load capability of 800 mA in PWM mode. Maximum load range may vary from this depending on input voltage, output voltage, and the inductor chosen. There are five modes of operation depending on the current required: pulse width modulation (PWM), ECOnomy (ECO), bypass (BP), sleep, and shutdown. (See Table 1.) The LM3262 operates in PWM mode at higher load current conditions. Lighter loads cause the device to automatically switch into ECO mode. Shutdown mode turns the device off and reduces battery consumption to 0.1 µA (typical). DC PWM mode output voltage precision is ±2% for 3.6 VOUT. Efficiency is approximately 93% (typical) for a 500-mA load with 3.4-V output, 3.8-V input. The output voltage is dynamically programmable from 0.4 V to 3.6 V by adjusting the voltage on the control pin (VCON) without the need for external feedback resistors. This ensures longer battery life by being able to change the PA supply voltage dynamically depending on its transmitting power. Additional features include current overload protection and thermal overload shutdown. The LM3262 is constructed using a chip-scale, 9-pin DSBGA package. This package offers the smallest possible size for space-critical applications, such as cell phones, where board area is an important design consideration. Use of a high switching frequency (6 MHz, typical) reduces the size of external components. As shown in the Typical Application Circuit, only three external power components are required for implementation. Use of a DSBGA package requires special design considerations for implementation. (See DSBGA Assembly and Use.) The fine bump-pitch of the DSBGA package requires careful board design and precision assembly equipment. Use of this package is best suited for opaque-case applications, where its edges are not subject to high-intensity ambient red or infrared light. Also, the system controller must set EN low during power-up and other low supply voltage conditions. (See Shutdown Mode.) Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback 11 Product Folder Links: LM3262 |
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