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TLP3073 Arkusz danych(PDF) 9 Page - Toshiba Semiconductor |
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TLP3073 Arkusz danych(HTML) 9 Page - Toshiba Semiconductor |
9 / 19 page TLP3073,TLP3073F 9 14. 14. 14. 14. Land Pattern Dimensions (for reference only) Land Pattern Dimensions (for reference only) Land Pattern Dimensions (for reference only) Land Pattern Dimensions (for reference only) (Unit: mm) Fig. Fig. Fig. Fig. 14.1 14.1 14.1 14.1 TLP3073 TLP3073 TLP3073 TLP3073 Lead forming and taping option Lead forming and taping option Lead forming and taping option Lead forming and taping option (LF1), (TP1), (LF5), (TP5) Fig. Fig. Fig. Fig. 14.2 14.2 14.2 14.2 TLP3073F TLP3073F TLP3073F TLP3073F Lead forming and taping option Lead forming and taping option Lead forming and taping option Lead forming and taping option (LF4), (TP4) 15. 15. 15. 15. Marking (Note) Marking (Note) Marking (Note) Marking (Note) Fig. Fig. Fig. Fig. 15.1 15.1 15.1 15.1 TLP3073 TLP3073 TLP3073 TLP3073 Fig. Fig. Fig. Fig. 15.2 15.2 15.2 15.2 TLP3073F TLP3073F TLP3073F TLP3073F Note: A different marking is used for photocouplers that have been qualified according to option (D4) of EN60747. See Fig.16.3 and Fig.16.4. 2016-02-03 Rev.4.0 ©2016 Toshiba Corporation |
Podobny numer części - TLP3073 |
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Podobny opis - TLP3073 |
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