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ADC08062BIN Arkusz danych(PDF) 6 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
Numer części ADC08062BIN
Szczegółowy opis  500 ns A/D Converter with S/H Function and Input Multiplexer
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Producent  NSC [National Semiconductor (TI)]
Strona internetowa  http://www.national.com
Logo NSC - National Semiconductor (TI)

ADC08062BIN Arkusz danych(HTML) 6 Page - National Semiconductor (TI)

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DC Electrical Characteristics (Continued)
The following specifications apply for V
+ = 5V unless otherwise specified. Boldface limits apply for T
A = TJ = TMIN to TMAX;
all other limits T
A = TJ = 25˚C.
Symbol
Parameter
Conditions
Typical
Limits
Units
(Limit)
(Note 7)
(Note 8)
V
IL
Logic “0” Input Voltage
V
+ = 4.5V
Mode Pin
1.5
V (max)
ADC08062
CS, WR, RD, A0 Pins
0.7
V (max)
ADC08061
CS, WR, RD Pins
0.8
V (max)
I
IH
Logic “1” Input Current
V
IH = 5V
CS, RD, A0 Pins
0.005
1
µA (max)
WR Pin
0.1
3
µA (max)
Mode Pin
50
200
µA (max)
I
IL
Logic “0” Input Current
V
IL = 0V
CS, RD, WR, A0 Pins
−0.005
µA (max)
Mode Pin
−2
V
OH
Logic “1” Output Voltage
V
+ = 4.75V
I
OUT = −360 µA
DB0–DB7, OFL, INT
2.4
V (min)
I
OUT = −10 µA
DB0–DB7, OFL, INT
4.5
V (min)
V
OL
Logic “0” Output Voltage
V
+ = 4.75V
I
OUT = 1.6 mA
0.4
V (max)
DB0–DB7, OFL, INT, RDY
I
O
TRI-STATE Output Current
V
OUT = 5.0V
0.1
3
µA (max)
DB0–DB7, RDY
V
OUT = 0V
−0.1
−3
µA (max)
DB0–DB7, RDY
I
SOURCE
Output Source Current
V
OUT = 0V
−26
−6
mA (min)
DB0–DB7, OFL, INT
I
SINK
Output Sink Current
V
OUT = 5V
24
7
mA (min)
DB0–DB7, OFL, INT, RDY
I
C
Supply Current
CS = WR = RD = 0
11.5
20
mA (max)
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not apply when operating
the device beyond its specified operating ratings. Operating Ratings indicate conditions for which the device is functional, but do not guarantee performance limits.
For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some per-
formance characteristics may degrade when the device is not operated under the listed test conditions.
Note 2: All voltages are measured with respect to the GND pin, unless otherwise specified.
Note 3: When the input voltage (VIN) at any pin exceeds the power supply voltage (VIN < GND or VIN > V
+), the absolute value of the current at that pin should be
limited to 5 mA or less. The 20 mA package input current specification limits the number of pins that can exceed the power supply boundaries witha5mA current
limit to four.
Note 4: The power dissipation of this device under normal operation should never exceed 875 mW (Quiescent Power Dissipation + the loads on the digital outputs).
Caution should be taken not to exceed absolute maximum power rating when the device is operating in a severe fault condition (e.g., when any input or output ex-
ceeds the power supply). The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX (maximum junction temperature), θJA
(package junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any temperature is PDmax = (TJMAX
−TA)/θJA or the number given in the Absolute Maximum Ratings, whichever is lower. The table below details TJMAX and θJA for the various packages and versions
of the ADC08061/2.
Part Number
TJMAX
θ
JA
ADC08061/2BIN
105
51
ADC08061/2CIWM
105
85
Note 5: See AN-450 “Surface Mounting Methods and Their Effect on Product Reliability” for other methods of soldering surface mount devices.
Note 6: Human body model, 100 pF discharged through a 1.5 k
Ω resistor.
Note 7: Typicals are at 25˚C and represent most likely parametric norm.
www.national.com
6


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