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SN74CBT3244PWE4 Arkusz danych(PDF) 4 Page - Texas Instruments

Numer części SN74CBT3244PWE4
Szczegółowy opis  Octal FET Bus Switch
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SN74CBT3244
SCDS001O – NOVEMBER 1992 – REVISED SEPTEMBER 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
Supply voltage, VCC
–0.5
7
V
Input voltage, VI
(2)
–0.5
7
V
Continuous channel current
128
mA
Clamp current, IK (VI/O < 0)
–50
mA
Storage temperature, Tstg
–65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
6.2 ESD Ratings
VALUE
UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±1500
V(ESD)
Electrostatic discharge
V
Charged-device model (CDM), per JEDEC specification JESD22-
±500
C101(2)
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
VCC
Supply voltage
4.5
5.5
V
VIH
High-level control input voltage
2
V
VIL
Low-level control input voltage
0.8
V
TA
Operating free-air temperature
–40
85
°C
(1)
All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, SCBA004.
6.4 Thermal Information Package
SN74CBT3244
DB
DBQ
DGV
PW
RGY
THERMAL METRIC(1)(2)
UNIT
(SSOP)
(SSOP)
(TVSOP)
(TSSOP)
(VQFN)
20 PINS
20 PINS
20 PINS
20 PINS
20 PINS
RθJA
Junction-to-ambient thermal resistance
70
68
92
83
37
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
(2)
The package thermal impedance is calculated in accordance with JESD 51-7.
4
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Copyright © 1992–2015, Texas Instruments Incorporated
Product Folder Links: SN74CBT3244


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