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ADC081S021CIMF Arkusz danych(PDF) 4 Page - Texas Instruments |
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ADC081S021CIMF Arkusz danych(HTML) 4 Page - Texas Instruments |
4 / 29 page 4 ADC081S021 SNAS308G – APRIL 2005 – REVISED MAY 2016 www.ti.com Product Folder Links: ADC081S021 Submit Documentation Feedback Copyright © 2005–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are measured with respect to GND = 0 V, unless otherwise specified. (3) If Military/Aerospace specified devices are required, please contact the TI Office/Distributors for availability and specifications. (4) When the input voltage at any pin exceeds the power supply (that is, VIN < GND or VIN > VA), the current at that pin must be limited to 10 mA. The 20 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 10 mA to two. These specifications do not apply to the VA pin. The current into the VA pin is limited by the analog supply voltage specification. (5) The absolute maximum junction temperature (TJmax) for this device is 150°C. The maximum allowable power dissipation is dictated by TJmax, the junction-to-ambient thermal resistance (θJA), and the ambient temperature (TA), and can be calculated using the formula PDMAX = (TJmax − TA) / θJA. The values for maximum power dissipation listed above is reached only when the device is operated in a severe fault condition (that is, when input or output pins are driven beyond the power supply voltages, or the power supply polarity is reversed). Such conditions must always be avoided. 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) (3) MIN MAX UNIT Analog supply voltage, VA –0.3 6.5 V Voltage on any analog pin to GND –0.3 VA + 0.3 V Voltage on any digital pin to GND –0.3 6.5 V Input current at any pin(4) ±10 mA Package input current(4) ±20 mA Power consumption at TA = 25°C See(5) Junction temperature, TJ 150 °C Storage temperature, Tstg –65 150 °C (1) Human body model is 100-pF capacitor discharged through a 1.5-k Ω resistor. Machine model is 220 pF discharged through 0 Ω. (2) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge(1) Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(2) ±3500 V Machine model (MM) ±300 (1) All voltages are measured with respect to GND = 0 V, unless otherwise specified. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VA Supply voltage 2.7 5.25 V Digital input pins voltage (regardless of supply voltage) –0.3 5.25 V Analog input pins voltage 0 VA V Clock frequency 25 20000 kHz Sample rate 1 Msps TA Operating temperature –40 85 °C |
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