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ADC11DV200 Arkusz danych(PDF) 6 Page - Texas Instruments |
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ADC11DV200 Arkusz danych(HTML) 6 Page - Texas Instruments |
6 / 30 page ADC11DV200 SNAS477A – APRIL 2009 – REVISED APRIL 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) (3) Supply Voltage (VA, VD VDR) −0.3V to 2.2V Voltage on Any Pin −0.3V to (VA +0.3V) (Not to exceed 2.2V) Input Current at Any Pin other than Supply Pins (4) ±25 mA Package Input Current (4) ±50 mA Max Junction Temp (TJ) +150°C Thermal Resistance ( θJA) (5) 30°C/W Human Body Model 2500V ESD Rating (6) Machine Model 250V Human Body Model 750V Storage Temperature −65°C to +150°C Soldering process must comply with TI's Reflow Temperature Profile specifications. Refer to www.ti.com/packaging.(7) (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is specified to be functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. Operation of the device beyond the maximum Operating Ratings is not recommended. (2) All voltages are measured with respect to GND = AGND = DRGND = 0V, unless otherwise specified. (3) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications. (4) When the input voltage at any pin exceeds the power supplies (that is, VIN < AGND, or VIN > VA), the current at that pin should be limited to ±5 mA. The ±50 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of ±5 mA to 10. (5) The maximum allowable power dissipation is dictated by TJ,max, the junction-to-ambient thermal resistance, (θJA), and the ambient temperature, (TA), and can be calculated using the formula PD,max = (TJ,max - TA )/θJA. The values for maximum power dissipation listed above will be reached only when the device is operated in a severe fault condition (e.g. when input or output pins are driven beyond the power supply voltages, or the power supply polarity is reversed). Such conditions should always be avoided. (6) Human Body Model is 100 pF discharged through a 1.5 k Ω resistor. Machine Model is 220 pF discharged through 0Ω resistor. Charged device model simulates a pin slowly acquiring charge (such as from a device sliding down the feeder in an automated assembler) then rapidly being discharged. (7) Reflow temperature profiles are different for lead-free and non-lead-free packages. Operating Ratings (1) (2) Operating Temperature −40°C ≤ TA ≤ +85°C Supply Voltage (VA, VD, VDR) +1.7V to +1.9V (DCS Enabled) 30/70 % Clock Duty Cycle (DCS disabled) 48/52 % VCM 0.8V to 1.0V (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is specified to be functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. Operation of the device beyond the maximum Operating Ratings is not recommended. (2) All voltages are measured with respect to GND = AGND = DRGND = 0V, unless otherwise specified. 6 Submit Documentation Feedback Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: ADC11DV200 |
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