ADC11DV200

SNAS477A – APRIL 2009 – REVISED APRIL 2013

www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2) (3)

−0.3V to 2.2V

Voltage on Any Pin

(Not to exceed 2.2V)

±25 mA

±50 mA

+150°C

Thermal Resistance (

(5)

30°C/W

Human Body Model

2500V

Machine Model

250V

Human Body Model

750V

Storage Temperature

−65°C to +150°C

Soldering process must comply with TI's Reflow Temperature Profile specifications. Refer to www.ti.com/packaging.(7)

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is specified to be functional, but do not ensure specific performance limits. For ensured specifications and test

conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance

characteristics may degrade when the device is not operated under the listed test conditions. Operation of the device beyond the

maximum Operating Ratings is not recommended.

(2)

All voltages are measured with respect to GND = AGND = DRGND = 0V, unless otherwise specified.

(3)

If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.

(4)

limited to ±5 mA. The ±50 mA maximum package input current rating limits the number of pins that can safely exceed the power

supplies with an input current of ±5 mA to 10.

(5)

above will be reached only when the device is operated in a severe fault condition (e.g. when input or output pins are driven beyond the

power supply voltages, or the power supply polarity is reversed). Such conditions should always be avoided.

(6)

Human Body Model is 100 pF discharged through a 1.5 k

Ω resistor. Machine Model is 220 pF discharged through 0Ω resistor. Charged

device model simulates a pin slowly acquiring charge (such as from a device sliding down the feeder in an automated assembler) then

rapidly being discharged.

(7)

Reflow temperature profiles are different for lead-free and non-lead-free packages.

Operating Ratings

(1) (2)

Operating Temperature

+1.7V to +1.9V

(DCS Enabled)

30/70 %

Clock Duty Cycle

(DCS disabled)

48/52 %

0.8V to 1.0V

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is specified to be functional, but do not ensure specific performance limits. For ensured specifications and test

conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance

characteristics may degrade when the device is not operated under the listed test conditions. Operation of the device beyond the

maximum Operating Ratings is not recommended.

(2)

All voltages are measured with respect to GND = AGND = DRGND = 0V, unless otherwise specified.

6

Submit Documentation Feedback

Copyright © 2009–2013, Texas Instruments Incorporated

Product Folder Links: ADC11DV200