Zakładka z wyszukiwarką danych komponentów |
|
ADC14DS080 Arkusz danych(PDF) 6 Page - Texas Instruments |
|
|
ADC14DS080 Arkusz danych(HTML) 6 Page - Texas Instruments |
6 / 36 page ADC14DS080 SNAS428B – SEPTEMBER 2007 – REVISED APRIL 2013 www.ti.com Pin Descriptions and Equivalent Circuits (continued) Pin No. Symbol Equivalent Circuit Description ANALOG POWER Positive analog supply pins. These pins should be connected to a 8, 16, 17, 58, VA quiet source and be bypassed to AGND with 0.1 µF capacitors 60 located close to the power pins. 1, 4, 12, 15, AGND The ground return for the analog supply. Exposed Pad DIGITAL POWER Positive driver supply pin for the output drivers. This pin should be 26, 40, 50 VDR connected to a quiet voltage source and be bypassed to DRGND with a 0.1 µF capacitor located close to the power pin. The ground return for the digital output driver supply. This pins 25, 39, 51 DRGND should be connected to the system digital ground, but not be connected in close proximity to the ADC's AGND pins. These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) (3) Supply Voltage (VA, VDR) −0.3V to 4.2V Voltage on Any Pin −0.3V to (VA +0.3V) (Not to exceed 4.2V) Input Current at Any Pin other than Supply Pins (4) ±5 mA Package Input Current (4) ±50 mA Max Junction Temp (TJ) +150°C Thermal Resistance ( θJA) (5) 30°C/W Human Body Model (6) 2500V ESD Rating Machine Model (6) 250V Storage Temperature −65°C to +150°C Soldering process must comply with TI's Reflow Temperature Profile specifications. Refer to www.ti.com/packaging.(7) (1) All voltages are measured with respect to GND = AGND = DRGND = 0V, unless otherwise specified. (2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is specified to be functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. Operation of the device beyond the maximum Operating Ratings is not recommended. (3) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications. (4) When the input voltage at any pin exceeds the power supplies (that is, VIN < AGND, or VIN > VA), the current at that pin should be limited to ±5 mA. The ±50 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of ±5 mA to 10. (5) The maximum allowable power dissipation is dictated by TJ,max, the junction-to-ambient thermal resistance, (θJA), and the ambient temperature, (TA), and can be calculated using the formula PD,max = (TJ,max - TA )/θJA. The values for maximum power dissipation listed above will be reached only when the device is operated in a severe fault condition (e.g. when input or output pins are driven beyond the power supply voltages, or the power supply polarity is reversed). Such conditions should always be avoided. (6) Human Body Model is 100 pF discharged through a 1.5 k Ω resistor. Machine Model is 220 pF discharged through 0 Ω (7) Reflow temperature profiles are different for lead-free and non-lead-free packages. Operating Ratings (1) (2) Operating Temperature −40°C ≤ TA ≤ +85°C Supply Voltages +2.7V to +3.6V (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is specified to be functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. Operation of the device beyond the maximum Operating Ratings is not recommended. (2) All voltages are measured with respect to GND = AGND = DRGND = 0V, unless otherwise specified. 6 Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: ADC14DS080 |
Podobny numer części - ADC14DS080 |
|
Podobny opis - ADC14DS080 |
|
|
Link URL |
Polityka prywatności |
ALLDATASHEET.PL |
Czy Alldatasheet okazała się pomocna? [ DONATE ] |
O Alldatasheet | Reklama | Kontakt | Polityka prywatności | Linki | Lista producentów All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |