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ADS7891IPFBTG4 Arkusz danych(PDF) 2 Page - Texas Instruments |
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ADS7891IPFBTG4 Arkusz danych(HTML) 2 Page - Texas Instruments |
2 / 31 page ADS7891 SLAS410 − DECEMBER 2003 www.ti.com 2 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION MODEL MAXIMUM INTEGRAL LINEARITY (LSB) MAXIMUM DIFFERENTIAL LINEARITY (LSB) NO MISSING CODES AT RESOLUTION (BIT) PACKAGE TYPE PACKAGE DESIGNATOR TEMPERATURE RANGE ORDERING INFORMATION TRANSPORT MEDIA QUANTITY ADS7891 ±1.5 +1.5/−1 14 48-Pin PFB −40 °C to 85°C ADS7891IPFBT Tape and reel 250 ADS7891 ±1.5 +1.5/−1 14 48-Pin TQFP PFB −40 °C to 85°C ADS7891IPFBR Tape and reel 1000 NOTE: For most current specifications and package information, refer to the TI website at www.ti.com. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range(1) UNIT +IN to AGND −0.3 V to +VA + 0.1 V −IN to AGND −0.3 V to 0.5 V +VA to AGND −0.3 V to 7 V +VBD to BDGND −0.3 V to 7 V Digital input voltage to GND −0.3 V to (+VBD + 0.3 V) Digital output to GND −0.3 V to (+VBD + 0.3 V) Operating temperature range −40 °C to 85°C Storage temperature range −65 °C to 150°C Junction temperature (TJmax) 150 °C TQFP package Power dissipation (TJ Max–TA)/ θJA TQFP package θJA Thermal impedance 86 °C/W Lead temperature, soldering Vapor phase (60 sec) 215 °C Lead temperature, soldering Infrared (15 sec) 220 °C (1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. |
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