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ADS8325IDGKR Arkusz danych(PDF) 7 Page - Texas Instruments |
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ADS8325IDGKR Arkusz danych(HTML) 7 Page - Texas Instruments |
7 / 36 page www.ti.com PIN CONFIGURATIONS 1 2 3 4 8 7 6 5 +V DD DCLOCK D OUT CS/SHDN REF +IN -IN GND ADS8325 REF +IN -IN GND +V DD DCLOCK D OUT CS/SHDN 1 2 3 4 8 7 6 5 ADS8325 (ThermalPad) ADS8325 SBAS226C – MARCH 2002 – REVISED AUGUST 2007 DGK PACKAGE MSOP (TOP VIEW) DRB PACKAGE(1) SON (TOP VIEW) (1) The thermal pad is internally connected to the substrate. This pad can be connected to the analog ground or left floating. Keep the thermal pad separate from the digital ground, if possible. PIN ASSIGNMENTS PIN NAME NO. I/O(1) DESCRIPTION REF 1 AI Reference Input +IN 2 AI Noninverting Input –IN 3 AI Inverting Analog Input GND 4 P Ground CS/SHDN 5 DI Chip select when low; Shutdown mode when high. DOUT 6 DO The serial output data word. DCLOCK 7 DI Data clock synchronizes the serial data transfer and determines conversion speed. +VDD 8 P Power supply (1) AI is Analog Input, DI is Digital Input, DO is Digital Output, and P is Power-Supply Connection. Copyright © 2002–2007, Texas Instruments Incorporated Submit Documentation Feedback 7 Product Folder Link(s): ADS8325 |
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