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ADS8912B Arkusz danych(PDF) 5 Page - Texas Instruments |
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ADS8912B Arkusz danych(HTML) 5 Page - Texas Instruments |
5 / 68 page 5 ADS8910B ADS8912B ADS8914B www.ti.com SBAS707A – JUNE 2016 – REVISED JULY 2016 Product Folder Links: ADS8910B ADS8912B ADS8914B Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT RVDD to GND –0.3 7 V DVDD to GND –0.3 7 V REFIN to REFM –0.3 RVDD + 0.3 V REFM to GND –0.1 0.1 V Analog Input (AINP, AINM) to GND –0.3 VREF + 0.3 V Digital input (RST, CONVST, CS, SCLK, SDI) to GND –0.3 DVDD + 0.3 V Digital output (READY, SDO-0, SDO-1, SDO-2, SDO-3) to GND –0.3 DVDD + 0.3 V Analog Input (AINP, AINM) to RVDD and GND –130 130 mA Operating free-air temperature, TA –40 125 °C Storage temperature, Tstg -65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±500 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT RVDD Analog supply voltage (RVDD to AGND) 3 5 5.5 V DVDD Digital supply voltage (DVDD to AGND) Operating 1.65 3 5.5 V Specified throughput 2.35 3 3.6 VREF Reference input voltage on REFIN 2.5 RVDD – 0.3 V CREFBUF External ceramic decoupling capacitor 10 22 µF RESR External series resistor 0 1 1.3 Ω TA Specified free-air operating temperature –40 25 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.4 Thermal Information THERMAL METRIC(1) ADS891xB UNITS RGE (VQFN) 24 PINS RθJA Junction-to-ambient thermal resistance 31.9 °C/W RθJC(top) Junction-to-case (top) thermal resistance 29.9 °C/W RθJB Junction-to-board thermal resistance 8.9 °C/W ψJT Junction-to-top characterization parameter 0.3 °C/W ψJB Junction-to-board characterization parameter 8.9 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 2.0 °C/W |
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