NC

NC

SCLK

GND

VSSOP

1

2

3

4

5

10

9

8

7

6

SYNC

NC

NC

SCLK

GND

SON

1

2

3

4

5

10

9

8

7

6

SYNC

3

DAC102S085

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SNAS364F – MAY 2006 – REVISED APRIL 2016

Product Folder Links: DAC102S085

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5 Description (continued)

A power-on reset circuit ensures that the DAC output powers up to zero volts and remains there until there is a

valid write to the device. A power-down feature reduces power consumption to less than a microWatt with three

different termination options.

The low power consumption and small packages of the DAC102S085 make it an excellent choice for use in

battery-operated equipment.

The DAC102S085 is one of a family of pin compatible DACs, including the 8-bit DAC084S085 and the 12-bit

DAC122S085. The DAC102S085 operates over the extended industrial temperature range of

−40°C to 105°C.

6 Pin Configuration and Functions

DSC Package

10-Pin WSON

Top View

DGS Package

10-Pin VSSOP

Top View

(1)

PAD is only applicable for the WSON package.

Pin Functions

PIN

TYPE

DESCRIPTION

NO.

NAME

1

Supply

Power supply input. Must be decoupled to GND.

2

Analog Output

Channel A Analog Output Voltage.

3

Analog Output

Channel B Analog Output Voltage.

4, 5

NC

—

Not Connected

6

GND

Ground

Ground reference for all on-chip circuitry.

7

Analog Input

Unbuffered reference voltage shared by all channels. Must be decoupled to GND.

8

Digital Input

Serial Data Input. Data is clocked into the 16-bit shift register on the falling edges of SCLK after

the fall of SYNC.

9

SYNC

Digital Input

Frame synchronization input for the data input. When this pin goes low, it enables the input shift

register and data is transferred on the falling edges of SCLK. The DAC is updated on the 16th

clock cycle unless SYNC is brought high before the 16th clock, in which case the rising edge of

SYNC acts as an interrupt and the write sequence is ignored by the DAC.

10

SCLK

Digital Input

Serial Clock Input. Data is clocked into the input shift register on the falling edges of this pin.

11

Ground

Exposed die attach pad can be connected to ground or left floating. Soldering the pad to the PCB

offers optimal thermal performance and enhances package self-alignment during reflow.