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LM2671 Arkusz danych(PDF) 4 Page - Texas Instruments

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Numer części LM2671
Szczegółowy opis  LM2671 SIMPLE SWITCHER짰 Power Converter High Efficiency 500-mA Step-Down Voltage Regulator With Features
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LM2671
SNVS008L – SEPTEMBER 1998 – REVISED JUNE 2016
www.ti.com
Product Folder Links: LM2671
Submit Documentation Feedback
Copyright © 1998–2016, Texas Instruments Incorporated
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1) (2)
MIN
MAX
UNIT
Supply voltage
45
V
ON/OFF pin voltage, VSH
−0.1
6
V
Switch voltage to ground
–1
V
Boost pin voltage
VSW + 8
V
Feedback pin voltage, VFB
−0.3
14
V
Power dissipation
Internally Limited
Lead temperature
D package
Vapor phase (60 s)
215
°C
Infrared (15 s)
220
P package (soldering, 10 s)
260
WSON package
See AN-1187
Maximum junction temperature
150
°C
Storage temperature, Tstg
−65
150
°C
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
The human body model is a 100-pF capacitor discharged through a 1.5-kΩ resistor into each pin.
7.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(2)
±2000
V
7.3 Recommended Operating Conditions
MIN
MAX
UNIT
Supply voltage
6.5
40
V
Junction temperature, TJ
–40
125
°C
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
(2)
Junction to ambient thermal resistance with approximately 1 square inch of printed-circuit board copper surrounding the leads. Additional
copper area lowers thermal resistance further. The value RθJA for the WSON (NHN) package is specifically dependent on PCB trace
area, trace material, and the number of layers and thermal vias. For improved thermal resistance and power dissipation for the WSON
package, see AN-1187 Leadless Leadframe Package (LLP).
7.4 Thermal Information
THERMAL METRIC(1)
LM2674
UNIT
D (SOIC)
P (PDIP)
NHN (WSON)
8 PINS
8 PINS
16 PINS
RθJA
Junction-to-ambient thermal resistance(2)
105
95
°C/W


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