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LM2940C Arkusz danych(PDF) 4 Page - Texas Instruments |
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LM2940C Arkusz danych(HTML) 4 Page - Texas Instruments |
4 / 37 page LM2940-N, LM2940C SNVS769J – MARCH 2000 – REVISED DECEMBER 2014 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings (1) (2) MIN MAX UNIT LM2940-N KTT, NDE, DCY ≤ 100 ms 60 V LM2940C KTT, NDE ≤ 1 ms 45 Internally Internal power dissipation(3) Limited Maximum junction temperature 150 TO-220 (NDE), Wave (10 s) 260 Soldering DDPAK/TO-263 (KTT) (30 s) 235 temperature(4) °C SOT-223 (DCY) (30 s) 260 WSON-8 (NGN) (30 s) 235 Storage temperature, Tstg −65 150 (1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Recommended Operating Conditions are conditions under which the device functions but the specifications might not be ensured. For ensured specifications and test conditions see the Electrical Characteristics (5 V and 8 V). (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. (3) The maximum allowable power dissipation is a function of the maximum junction temperature, TJ, the junction-to-ambient thermal resistance, RθJA, and the ambient temperature, TA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. The value of R θJA (for devices in still air with no heatsink) is 23.3°C/W for the TO-220 package, 40.9°C/W for the DDPAK/TO-263 package, and 59.3°C/W for the SOT-223 package. The effective value of RθJA can be reduced by using a heatsink (see Heatsinking for specific information on heatsinking). The value of RθJA for the WSON package is specifically dependent on PCB trace area, trace material, and the number of layers and thermal vias. For improved thermal resistance and power dissipation for the WSON package, refer to Application Note AN-1187 Leadless Leadframe Package (LLP) (SNOA401). It is recommended that 6 vias be placed under the center pad to improve thermal performance. (4) Refer to JEDEC J-STD-020C for surface mount device (SMD) package reflow profiles and conditions. Unless otherwise stated, the temperature and time are for Sn-Pb (STD) only. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT Input voltage 6 26 V LM2940-N NDE, LM2940-N KTT −40 125 LM2940C NDE, LM2940C KTT 0 125 Temperature °C LM2940-N DCY −40 85 LM2940-N NGN −40 125 4 Submit Documentation Feedback Copyright © 2000–2014, Texas Instruments Incorporated Product Folder Links: LM2940-N LM2940C |
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