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LM293ADGK Arkusz danych(PDF) 4 Page - Texas Instruments |
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4 / 25 page LM193, LM293, LM293A, LM393, LM393A, LM2903, LM2903V SLCS005Y – OCTOBER 1979 – REVISED JUNE 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VCC Supply voltage(2) 36 V VID Differential input voltage(3) ±36 V VI Input voltage (either input) –0.3 36 V VO Output voltage 36 V IO Output current 20 mA Duration of output short circuit to ground(4) Unlimited TJ Operating virtual-junction temperature 150 °C Case temperature for 60 s FK package 260 °C Lead temperature 1,6 mm (1/16 in) from case for 60 s J package 300 °C Tstg Storage temperature –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values, except differential voltages, are with respect to network ground. (3) Differential voltages are at IN+ with respect to IN–. (4) Short circuits from outputs to VCC can cause excessive heating and eventual destruction. 6.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) 1000 V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) 750 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VCC (non-V devices) 2 30 V VCC (V devices) 2 32 V TJ Junction Temperature –40 125 °C 6.4 Thermal Information LMx93, LM2903 PW DGK PS JG FK THERMAL METRIC(1) D (SOIC) P (PDIP) (TSSO UNIT (VSSOP) (SO) (GDIP) (LCCC) P) 8 PINS 8 PINS 8 PINS 8 PINS 8 PINS 8 PINS 20 PINS RθJA Junction-to-ambient thermal resistance 97 172 85 95 149 — — °C/W RθJC(top) Junction-to-case (top) thermal resistance — — — — — 14.5 5.61 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 1979–2015, Texas Instruments Incorporated Product Folder Links: LM193 LM293 LM293A LM393 LM393A LM2903 LM2903V |
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