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SN74AUP1G80DRYR Arkusz danych(PDF) 2 Page - Texas Instruments |
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2 / 25 page AUP LVC AUP AUP LVC Static-Power Consumption ( µA) Dynamic-Power Consumption (pF) † Single, dual, and triple gates 3.3-V Logic† 3.3-V Logic† 0% 20% 40% 60% 80% 100% 0% 20% 40% 60% 80% 100% −0.5 0 0.5 1 1.5 2 2.5 3 3.5 0 5 10 15 20 25 30 35 40 45 Time − ns † AUP1G08 data at C L = 15 pF Output Input Switching Characteristics at 25 MHz† D CLK Q CLK D Q SN74AUP1G80 SCES593E – JULY 2004 – REVISED MAY 2010 www.ti.com Figure 1. AUP – The Lowest-Power Family Figure 2. Excellent Signal Integrity This is a single positive-edge-triggered D-type flip-flop. When data at the data (D) input meets the setup time requirement, the data is transferred to the Q output on the positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not directly related to the rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without affecting the levels at the outputs. NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. ORDERING INFORMATION(1) ORDERABLE PART TOP-SIDE TA PACKAGE(2) NUMBER MARKING(3) NanoStar – WCSP (DSBGA) Reel of 3000 SN74AUP1G80YFPR _ _ _HX_ 0.23-mm Large Bump – YFP NanoStar – WCSP (DSBGA) Reel of 3000 SN74AUP1G80YZPR _ _ _HX_ 0.23-mm Large Bump – YZP (Pb-free) QFN – DRY Reel of 5000 SN74AUP1G80DRYR HX –40°C to 85°C uQFN – DSF Reel of 5000 SN74AUP1G80DSFR HX Reel of 3000 SN74AUP1G80DBVR SOT (SOT-23) – DBV H80_ Reel of 250 SN74AUP1G80DBVT Reel of 3000 SN74AUP1G80DCKR SOT (SC-70) – DCK HX_ Reel of 250 SN74AUP1G80DCKT (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. (2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. (3) DBV/DCK: The actual top-side marking has one additional character that designates the wafer fab/assembly site. YFP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). FUNCTION TABLE INPUTS OUTPUT Q CLK D ↑ H L ↑ L H L or H X Q 0 LOGIC DIAGRAM (POSITIVE LOGIC) 2 Submit Documentation Feedback Copyright © 2004–2010, Texas Instruments Incorporated Product Folder Link(s): SN74AUP1G80 |
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