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TPD1E05U06 Arkusz danych(PDF) 4 Page - Texas Instruments

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Numer części TPD1E05U06
Szczegółowy opis  ADAS Applications Processor 23mm Package (ABC Package) Silicon Revision 2.0
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Strona internetowa  http://www.ti.com
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TPD1E05U06 Arkusz danych(HTML) 4 Page - Texas Instruments

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TDA2SX, TDA2SG
TDA2HG, TDA2HV, TDA2LF
SPRS951A – DECEMBER 2015 – REVISED APRIL 2016
www.ti.com
Submit Documentation Feedback
Product Folder Links: TDA2SX TDA2SG TDA2HG TDA2HV TDA2LF
Table of Contents
Copyright © 2015–2016, Texas Instruments Incorporated
Table of Contents
1
Device Overview
......................................... 1
1.1
Features
.............................................. 1
1.2
Applications
........................................... 2
1.3
Description
............................................ 2
1.4
Related Links
......................................... 2
1.5
Functional Block Diagram
........................... 2
2
Revision History
......................................... 5
3
Device Comparison
..................................... 6
3.1
Device Comparison Table
............................ 6
3.2
Related Products
..................................... 8
4
Terminal Configuration and Functions
.............. 9
4.1
Terminal Assignment
................................. 9
4.2
Ball Characteristics
.................................. 10
4.3
Multiplexing Characteristics
......................... 77
4.4
Signal Descriptions
.................................. 95
5
Specifications
......................................... 136
5.1
Absolute Maximum Ratings
........................ 136
5.2
ESD Ratings
....................................... 137
5.3
Power on Hour (POH) Limits
...................... 137
5.4
Recommended Operating Conditions
............. 138
5.5
Operating Performance Points
..................... 141
5.6
Power Consumption Summary
.................... 158
5.7
Electrical Characteristics
........................... 158
5.8
Thermal Resistance Characteristics
............... 166
5.9
Power Supply Sequences
......................... 167
6
Clock Specifications
................................. 178
6.1
Input Clock Specifications
......................... 179
6.2
DPLLs, DLLs Specifications
....................... 187
7
Timing Requirements and Switching
Characteristics
........................................ 191
7.1
Timing Test Conditions
............................ 191
7.2
Interface Clock Specifications
..................... 191
7.3
Timing Parameters and Information
............... 191
7.4
Recommended Clock and Control Signal Transition
Behavior
............................................ 193
7.5
Virtual and Manual I/O Timing Modes
............. 193
7.6
Video Input Ports (VIP)
............................ 196
7.7
Display Subsystem – Video Output Ports
......... 214
7.8
Display Subsystem – High-Definition Multimedia
Interface (HDMI)
................................... 225
7.9
External Memory Interface (EMIF)
................. 225
7.10
General-Purpose Memory Controller (GPMC)
..... 225
7.11
Timers
.............................................. 247
7.12
Inter-Integrated Circuit Interface (I2C)
............. 248
7.13
Universal Asynchronous Receiver Transmitter
(UART)
............................................. 251
7.14
Multichannel Serial Peripheral Interface (MCSPI)
. 252
7.15
Quad Serial Peripheral Interface (QSPI)
.......... 258
7.16
Multichannel Audio Serial Port (McASP)
.......... 264
7.17
Universal Serial Bus (USB)
........................ 284
7.18
Serial Advanced Technology Attachment (SATA)
. 286
7.19
Peripheral Component Interconnect Express
(PCIe)
.............................................. 286
7.20
Controller Area Network Interface (DCAN)
........ 287
7.21
Ethernet Interface (GMAC_SW)
................... 288
7.22
eMMC/SD/SDIO
................................... 298
7.23
General-Purpose Interface (GPIO)
................ 325
7.24
System and Miscellaneous interfaces
............. 325
7.25
Test Interfaces
..................................... 325
8
Applications, Implementation, and Layout
...... 330
8.1
Introduction
........................................ 330
8.2
Power Optimizations
............................... 331
8.3
Core Power Domains
.............................. 345
8.4
Single-Ended Interfaces
........................... 356
8.5
Differential Interfaces
.............................. 358
8.6
Clock Routing Guidelines
.......................... 379
8.7
DDR2/DDR3 Board Design and Layout
Guidelines
.......................................... 381
9
Device and Documentation Support
.............. 416
9.1
Device Nomenclature & Orderable Information
.... 416
9.2
Tools and Software
................................ 418
9.3
Documentation Support
............................ 419
9.4
Receiving Notification of Documentation Updates
. 419
9.5
Related Links
...................................... 419
9.6
Community Resources
............................. 420
9.7
Trademarks
........................................ 420
9.8
Electrostatic Discharge Caution
................... 420
9.9
Export Control Notice
.............................. 420
9.10
Glossary
............................................ 421
10
Mechanical Packaging and Orderable
Information
............................................. 422
10.1
Mechanical Data
................................... 422


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