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AM26C31CDRE4 Arkusz danych(PDF) 4 Page - Texas Instruments |
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AM26C31CDRE4 Arkusz danych(HTML) 4 Page - Texas Instruments |
4 / 33 page 4 AM26C31 SLLS103O – DECEMBER 1990 – REVISED JUNE 2016 www.ti.com Product Folder Links: AM26C31 Submit Documentation Feedback Copyright © 1990–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values, except differential voltages, are with respect to the network ground terminal. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VCC Supply voltage(2) –0.5 7 V VI Input voltage –0.5 VCC + 0.5 V VID Differential input voltage –14 14 V VO Output voltage –0.5 7 IIK IOK Input or output clamp current ±20 mA IO Output current ±150 mA VCC current 200 mA GND current –200 mA TJ Operating virtual junction temperature 150 °C Tstg Storage temperature –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000 6.3 Recommended Operating Conditions MIN NOM MAX UNIT VCC Supply voltage 4.5 5 5.5 V VID Differential input voltage ±7 V VIH High-level input voltage 2 V VIL Low-level input voltage 0.8 V IOH High-level output current –20 mA IOL Low-level output current 20 mA TA Operating free-air temperature AM26C31C 0 70 °C AM26C31I –40 85 AM26C31Q –40 125 AM26C31M –55 125 |
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