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MC33997 Arkusz danych(PDF) 5 Page - Motorola, Inc |
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MC33997 Arkusz danych(HTML) 5 Page - Motorola, Inc |
5 / 20 page MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA 33997 5 MAXIMUM RATINGS All voltages are with respect to ground unless otherwise noted. Rating Symbol Value Unit Main Supply Voltage VPWR -0.3 to 45 V Keep-Alive Supply Voltage KA_VPWR -0.3 to 45 V Switching Node VSW -0.5 to 45 V 5.0 V Input Power VDDH -0.3 to 6.0 V Sensor Supply VREF1 VREF2 -0.3 to 18 -0.3 to 18 V Keep-Alive Supply Voltage VKAM -0.3 to 6.0 V Maximum Voltage at Logic I/O Pins EN SNSEN PWROK VKAMOK -0.3 to 6.0 -0.3 to 6.0 -0.3 to 6.0 -0.3 to 6.0 V Charge Pump Reservoir Capacitor Voltage CRES -0.3 to 18 V Error Amplifier Summing Node VSUM -0.3 to 6.0 V Switching Regulator Output Feedback FBKB -0.3 to 6.0 V VDDL Base Drive DRVL -0.3 to 6.0 V VDDL Feedback FBL -0.3 to 6.0 V ESD Voltage Human Body Model (all pins) (Note 1) Machine Model (all pins) (Note 2) VESD1 VESD2 ±500 ±100 V Power Dissipation (TA = 25°C) (Note 3) PD 800 mW Thermal Resistance, Junction to Ambient (Note 4), (Note 5) RθJ-A 60 °C/W Thermal Resistance, Junction to Board (Note 6) RθJ-B 20 °C/W Operational Package Temperature [Ambient Temperature] (Note 7) TA -40 to 125 °C Operational Junction Temperature TJ -40 to 150 °C Storage Temperature TSTG -55 to 150 °C Lead Soldering Temperature (Note 8) TS 260 °C Notes 1. ESD1 testing is performed in accordance with the Human Body Model (CZAP=100 pF, RZAP=1500 Ω). 2. ESD2 testing is performed in accordance with the Machine Model (CZAP=200 pF, RZAP=0 Ω) 3. Maximum power dissipation at indicated junction temperature. 4. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance. 5. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal. 6. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface of the board near the package. 7. The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heat sinking. 8. Lead soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device. Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
Podobny numer części - MC33997 |
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Podobny opis - MC33997 |
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