SN74LVC1G57

CONFIGURABLE MULTIPLEFUNCTION GATE

SCES414G − NOVEMBER 2002 − REVISED SEPTEMBER 2003

1

POST OFFICE BOX 655303

NanoStar

 and NanoFree Packages

Operation

Per JESD 78, Class II

− 2000-V Human-Body Model (A114-A)

− 200-V Machine Model (A115-A)

− 1000-V Charged-Device Model (C101)

description/ordering information

The SN74LVC1G57 features configurable multiple functions. The output state is determined by eight patterns

of 3-bit input. The user can choose the logic functions AND, OR, NAND, NOR, XNOR, inverter, and noninverter.

This device functions as an independent gate, but because of Schmitt action, it may have different input

NanoStar

 and NanoFree package technology is a major breakthrough in IC packaging concepts, using the

die as the package.

ORDERING INFORMATION

TA

PACKAGE†

ORDERABLE

PART NUMBER

TOP-SIDE

MARKING‡

NanoStar

 − WCSP (DSBGA)

0.17-mm Small Bump − YEA

SN74LVC1G57YEAR

NanoFree

 − WCSP (DSBGA)

0.17-mm Small Bump − YZA (Pb-free)

Tape and reel

SN74LVC1G57YZAR

_ _ _CL_

−40

°C to 85°C

NanoStar

 − WCSP (DSBGA)

0.23-mm Large Bump − YEP

Tape and reel

SN74LVC1G57YEPR

_ _ _CL_

NanoFree

 − WCSP (DSBGA)

0.23-mm Large Bump − YZP (Pb-free)

SN74LVC1G57YZPR

SOT (SOT-23) − DBV

Tape and reel

SN74LVC1G57DBVR

CA7_

SOT (SC-70) − DCK

Tape and reel

SN74LVC1G57DCKR

CL_

† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

‡ DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.

YEA/YZA,YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code,

and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition

(1 = SnPb,

Copyright

 2003, Texas Instruments Incorporated

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

NanoStar and NanoFree are trademarks of Texas Instruments.

DBV OR DCK PACKAGE

(TOP VIEW)

1

2

3

6

5

4

In1

GND

In0

In2

Y

3

2

1

4

5

6

In0

GND

In1

Y

In2

YEA, YEP, YZA OR YZP PACKAGE

(BOTTOM VIEW)

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.