NXP Semiconductors

MC33HB2001

10 A H-Bridge, SPI programmable brushed DC motor driver

MC33HB2001

All information provided in this document is subject to legal disclaimers.

© NXP B.V. 2016. All rights reserved

Data sheet: Advance information

Rev. 6.0 — 3 May 2016

10 / 48

[2]

Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction

or permanent damage to the device.

[3]

NXP's Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow Temperature and Moisture

Sensitivity Levels (MSL), Go to nxp.com, search by part number. Remove prefixes/suffixes and enter the core ID to view all orderable parts (for

MC33xxxD enter 33xxx), and review parametrics.

[4]

Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient

temperature, air flow, power dissipation of other components on the board, and board thermal resistance.

[5]

Per JEDEC JESD51-2 with natural convection for horizontally oriented board. Board meets JESD51-9 specification for 1s or 2s2p board, respectively.

[6]

Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface of the board

near the package.

[7]

Thermal resistance between the die and the solder pad on the bottom of the package. Interface resistance is ignored.

[8]

Thermal characterization parameter indicating the temperature difference between package top and the junction temperature per JEDEC JESD51-2.

When Greek letters (Ψ) are not available, the thermal characterization parameter is written as Psi-JT.

8.3 Operating conditions

This section describes the operating conditions of the device. Conditions apply to the

following data, unless otherwise noted.

Table 5. Nominal operation

Within the range of functionality, all functionalities have to be guaranteed. All voltages refer to GND. Currents are positive

Symbol

Description (Rating)

Min.

Max.

Unit

SUPPLY VOLTAGE

Functional operating supply voltage range—VPWR

5.0

28

V

SPI

SPI frequency range

0.5

10

MHz

Table 6. Supply current consumption

Symbol

Description (Rating)

Min.

Max.

Unit

VPWR SUPPLY CURRENT CONSUMPTIONS

[1]

—

20

mA

[2]

—

50

μA

LEAKAGE CURRENTS FOR THE FUNCTIONS CONNECTED TO VPWR

Output leakage current, outputs off, VPWR = 28 V

—

−60

100

—

μA

[1]

[2]

8.3.1 Reverse battery

To protect against a reverse battery condition, a dedicated device to block reverse

current must be populated in the application, as shown in Figure 21 (with a diode).

Some applications require operation at very low battery voltages (start-stop applications),

and many systems have multiple H-Bridges in parallel, which require high current reverse

battery protection with very low voltage drops during the operation. In such applications,

an external, reverse-polarity, FET may be used instead of the reverse protection diode, to