SN74AUC1G17

SINGLE SCHMITT TRIGGER BUFFER

SCES376J − SEPTEMBER 2001 − REVISED OCTOBER 2003

1

POST OFFICE BOX 655303

NanoStar

 and NanoFree Packages

I/O Tolerant to Support Mixed-Mode Signal

Operation

Operation

JESD 78, Class II

− 2000-V Human-Body Model (A114-A)

− 200-V Machine Model (A115-A)

− 1000-V Charged-Device Model (C101)

description/ordering information

The SN74AUC1G17 contains one buffer and performs the Boolean function Y = A. The device functions as an

independent buffer, but because of Schmitt action, it may have different input threshold levels for positive-going

NanoStar

 and NanoFree package technology is a major breakthrough in IC packaging concepts, using the

die as the package.

ORDERING INFORMATION

TA

PACKAGE†

ORDERABLE

PART NUMBER

TOP-SIDE

MARKING‡

NanoStar

 − WCSP (DSBGA)

0.17-mm Small Bump − YEA

SN74AUC1G17YEAR

NanoFree

 − WCSP (DSBGA)

0.17-mm Small Bump − YZA (Pb-free)

Tape and reel

SN74AUC1G17YZAR

_ _ _U7_

−40

°C to 85°C

NanoStar

 − WCSP (DSBGA)

0.23-mm Large Bump − YEP

Tape and reel

SN74AUC1G17YEPR

_ _ _U7_

NanoFree

 − WCSP (DSBGA)

0.23-mm Large Bump − YZP (Pb-free)

SN74AUC1G17YZPR

SOT (SOT-23) − DBV

Tape and reel

SN74AUC1G17DBVR

U17_

SOT (SC-70) − DCK

Tape and reel

SN74AUC1G17DCKR

U7_

† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

‡ DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.

YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code,

and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,

• = Pb-free).

Copyright

 2003, Texas Instruments Incorporated

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

NanoStar and NanoFree are trademarks of Texas Instruments.

DBV OR DCK PACKAGE

(TOP VIEW)

1

2

3

5

4

NC

A

GND

Y

NC − No internal connection

DNU − Do not use

3

2

1

4

5

GND

A

DNU

Y

YEA, YEP, YZA, OR YZP PACKAGE

(BOTTOM VIEW)

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.