MC10EP32, MC100EP32

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8

ORDERING INFORMATION

Device

Package

MC10EP32DG

SOIC−8NB

(Pb-Free)

98 Units / Rail

MC10EP32DR2G

SOIC−8NB

(Pb-Free)

2500 / Tape & Reel

MC10EP32DTG

TSSOP−8

(Pb-Free)

100 Units / Rail

MC10EP32DTR2G

TSSOP−8

(Pb-Free)

2500 / Tape & Reel

MC10EP32MNR4G

DFN−8

(Pb-Free)

1000 / Tape & Reel

MC100EP32DG

SOIC−8NB

(Pb-Free)

98 Units / Rail

MC100EP32DR2G

SOIC−8NB

(Pb-Free)

2500 / Tape & Reel

MC100EP32DTG

TSSOP−8

(Pb-Free)

100 Units / Rail

MC100EP32DTR2G

TSSOP−8

(Pb-Free)

2500 / Tape & Reel

MC100EP32MNR4G

DFN−8

(Pb-Free)

1000 / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

Resource Reference of Application Notes

AN1405/D

− ECL Clock Distribution Techniques

AN1406/D

− Designing with PECL (ECL at +5.0 V)

AN1503/D

− ECLinPSt I/O SPiCE Modeling Kit

AN1504/D

− Metastability and the ECLinPS Family

AN1568/D

− Interfacing Between LVDS and ECL

AN1672/D

− The ECL Translator Guide

AND8001/D − Odd Number Counters Design

AND8002/D − Marking and Date Codes

AND8020/D − Termination of ECL Logic Devices

AND8066/D − Interfacing with ECLinPS

AND8090/D − AC Characteristics of ECL Devices