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LM3671MF-1.5 Arkusz danych(PDF) 4 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
Numer części LM3671MF-1.5
Szczegółowy opis  2MHz , 600mA Step-Down DC-DC Converter in SOT23-5
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Producent  NSC [National Semiconductor (TI)]
Strona internetowa  http://www.national.com
Logo NSC - National Semiconductor (TI)

LM3671MF-1.5 Arkusz danych(HTML) 4 Page - National Semiconductor (TI)

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Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
V
IN Pin: Voltage to GND
−0.2V to 6.0V
FB, SW, EN Pin:
(GND−0.2V) to
(V
IN + 0.2V)
Continuous Power Dissipation
(Note 3)
Internally Limited
Junction Temperature (T
J-MAX)
+125˚C
Storage Temperature Range
−65˚C to +150˚C
Maximum Lead Temperature
(Soldering, 10 sec.)
260˚C
ESD Rating (Note 4)
Human Body Model:
V
IN,GND,SW,FB
2.0 kV
Human Body Model: EN
500V
Machine Model: All Pins
200V
Operating Ratings (Notes 1, 2)
Input Voltage Range
2.8V to 5.5V
Recommended Load Current
0mA to 600 mA
Junction Temperature (T
J) Range
−25˚C to +125˚C
Ambient Temperature (T
A) Range (Note 5)
−25˚C to +85˚C
Thermal Properties
Junction-to-Ambient
Thermal Resistance (
θ
JA)
(SOT23-5) (Note 6)
250˚C/W
Electrical Characteristics (Notes 2, 9, 10) Limits in standard typeface are for T
J = 25˚C. Limits in boldface
type apply over the full operating junction temperature range (−25˚C
≤ T
J
≤ +125˚C). Unless otherwise noted, specifications
apply to the LM3671 Typical Application Circuit (Figure. 1) with V
IN = EN = 3.6V, VOUT = 1.5V
Symbol
Parameter
Condition
Min
Typ
Max
Units
V
IN
Input Voltage Range
(Note 11)
2.8
5.5
V
V
OUT
Output Voltage
I
O =0 mA
−2
+4
%
I
O = 100 mA
−4
+4
%
Line Regulation
2.8V
≤ V
IN
≤ 5.5V
I
O =10 mA
0.045
%/V
Load Regulation
100 mA
≤ I
O
≤ 300 mA
V
IN= 3.6V
0.0031
%/mA
V
REF
Internal Reference Voltage
(Note 7)
0.5
V
I
SHDN
Shutdown Supply Current
EN = 0V
0.01
1
µA
I
Q_PFM
DC Bias Current into V
IN
No load, device is not switching (FB
forced higher than programmed output
voltage)
16
35
µA
R
DSON (P)
Pin-Pin Resistance for PFET
V
IN=VGS= 3.6V
380
500
m
R
DSON (N)
Pin-Pin Resistance for NFET
V
IN=VGS= 3.6V
250
400
m
I
LIM
Switch Peak Current Limit
Open Loop (Note 8)
830
1020
1150
mA
V
IH
Logic High Input
1.0
V
V
IL
Logic Low Input
0.4
V
I
EN
Enable (EN) Input Current
0.01
1
µA
F
OSC
Internal Oscillator Frequency
PWM Mode
1.6
2
2.6
MHz
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation of
the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the
Electrical Characteristics tables.
Note 2: All voltages are with respect to the potential at the GND pin.
Note 3: Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ= 150˚C (typ.) and disengages at TJ=
130˚C (typ.).
Note 4: The Human body model is a 100 pF capacitor discharged through a 1.5 k
Ω resistor into each pin. The machine model is a 200 pF capacitor discharged
directly into each pin. MIL-STD-883 3015.7
Note 5: In Applications where high power dissipation and/or poor package resistance is present, the maximum ambient temperature may have to be derated.
Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX), the maximum power dissipation of the device in
the application (PD-MAX) and the junction to ambient thermal resistance of the package (θJA) in the application, as given by the following equation:TA-MAX=TJ-MAX
(
θJAxPD-MAX). Refer to Dissipation rating table for PD-MAX values at different ambient temperatures.
Note 6: Junction to ambient thermal resistance is highly application and board layout dependent. In applications where high power dissipation exists, special care
must be given to thermal dissipation issues in board design. Value specified here 250 ˚C/W is based on measurement results using a 2 layer, 4" x 3", 2 oz Cu board
as per JEDEC standards. The (
θJA) can be as low as 140 ˚C/W if a 4 layer, 4" x 3", 2/1/1/2 oz. Cu board as per JEDEC standards is used.
Note 7: For the ADJ version the resistor dividers should be selected such that at the desired output voltage,the voltage at the FB pin is 0.5V.
www.national.com
4


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