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ADT7411ARQZ10 Arkusz danych(PDF) 7 Page - Analog Devices |
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ADT7411ARQZ10 Arkusz danych(HTML) 7 Page - Analog Devices |
7 / 36 page ADT7411 Rev. A | Page 7 of 36 ABSOLUTE MAXIMUM RATINGS Table 2. Parameter Rating VDD to GND −0.3 V to +7 V Analog Input Voltage to GND −0.3 V to VDD + 0.3 V Digital Input Voltage to GND −0.3 V to VDD + 0.3 V Operating Temperature Range −40°C to +120°C Storage Temperature Range −65°C to +150°C Junction Temperature 150°C 16-Lead QSOP Package Power Dissipation8 (TJmax − TA)/θJA Thermal Impedance9 θJA Junction-to-Ambient 105.44°C/W θJC Junction-to-Case 38.8°C/W IR Reflow Soldering Peak Temperature 220°C (0°C/5°C) Time at Peak Temperature 10 sec to 20 sec Ramp-Up Rate 2°C/sec to 3°C/sec Ramp-Down Rate −6°C/sec 8 Values relate to package being used on a 4-layer board 9 Junction-to-case resistance is applicable to components featuring a preferential flow direction, e.g., components mounted on a heat sink. Junction-to-ambient resistance is more useful for air-cooled PCB-mounted components. Table 3. I2C Address Selection ADD Pin I2C Address Low 1001 000 Float 1001 010 High 1001 011 Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ESD CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electro-static discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. |
Podobny numer części - ADT7411ARQZ10 |
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Podobny opis - ADT7411ARQZ10 |
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