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ADS8900BRGER Arkusz danych(PDF) 5 Page - Texas Instruments

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Numer części ADS8900BRGER
Szczegółowy opis  20-Bit, High-Speed SAR ADCs With Integrated Reference Buffer, Integrated LDO, and multiSPI Digital Interface
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Producent  TI1 [Texas Instruments]
Strona internetowa  http://www.ti.com
Logo TI1 - Texas Instruments

ADS8900BRGER Arkusz danych(HTML) 5 Page - Texas Instruments

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ADS8900B, ADS8902B, ADS8904B
www.ti.com
SBAS728 – NOVEMBER 2016
Product Folder Links: ADS8900B ADS8902B ADS8904B
Submit Documentation Feedback
Copyright © 2016, Texas Instruments Incorporated
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6 Specifications
6.1
Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
RVDD to GND
–0.3
7
V
DVDD to GND
–0.3
7
V
REFIN to REFM
–0.3
RVDD + 0.3
V
REFM to GND
–0.1
0.1
V
Analog Input (AINP, AINM) to GND
–0.3
VREF + 0.3
V
Digital input (RST, CONVST, CS, SCLK, SDI) to GND
–0.3
DVDD + 0.3
V
Digital output (READY, SDO-0, SDO-1, SDO-2, SDO-3) to GND
–0.3
DVDD + 0.3
V
Analog Input (AINP, AINM) to RVDD and GND
–130
130
mA
Operating free-air temperature, TA
–40
125
°C
Storage temperature, Tstg
–65
150
°C
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
±500
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
RVDD
Analog supply voltage (RVDD to AGND)
3
5
5.5
V
DVDD
Digital supply voltage (DVDD to AGND)
Operating
1.65
3
5.5
V
Specified throughput
2.35
3
3.6
VREF
Reference input voltage on REFIN
2.5
RVDD – 0.3
V
CREFBUF
External ceramic decoupling capacitor
10
22
µF
RESR
External series resistor
0
1
1.3
Ω
TA
Specified free-air operating temperature
–40
25
125
°C
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.4 Thermal Information
THERMAL METRIC(1)
ADS890xB
UNITS
RGE (VQFN)
24 PINS
RθJA
Junction-to-ambient thermal resistance
31.9
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
29.9
°C/W
RθJB
Junction-to-board thermal resistance
8.9
°C/W
ψJT
Junction-to-top characterization parameter
0.3
°C/W
ψJB
Junction-to-board characterization parameter
8.9
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
2.0
°C/W


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