Zakładka z wyszukiwarką danych komponentów |
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HCPL-7800 Arkusz danych(PDF) 3 Page - Agilent(Hewlett-Packard) |
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HCPL-7800 Arkusz danych(HTML) 3 Page - Agilent(Hewlett-Packard) |
3 / 17 page 1-218 Maximum Solder Reflow Thermal Profile 240 ∆T = 115°C, 0.3°C/SEC 0 ∆T = 100°C, 1.5°C/SEC ∆T = 145°C, 1°C/SEC TIME – MINUTES 220 200 180 160 140 120 100 80 60 40 20 0 260 12 3 456789 10 11 12 (NOTE: USE OF NON-CHLORINE ACTIVATED FLUXES IS RECOMMENDED.) Gull Wing Surface Mount Option 300* 0.635 ± 0.25 (0.025 ± 0.010) 12° NOM. 0.20 (0.008) 0.33 (0.013) 9.65 ± 0.25 (0.380 ± 0.010) 0.51 ± 0.130 (0.020 ± 0.005) 7.62 ± 0.25 (0.300 ± 0.010) 5 6 7 8 4 3 2 1 9.65 ± 0.25 (0.380 ± 0.010) 6.350 ± 0.25 (0.250 ± 0.010) 1.02 (0.040) 1.19 (0.047) 1.19 (0.047) 1.78 (0.070) 9.65 ± 0.25 (0.380 ± 0.010) 4.83 (0.190) TYP. 0.380 (0.015) 0.635 (0.025) PIN LOCATION (FOR REFERENCE ONLY) 1.080 ± 0.320 (0.043 ± 0.013) 4.19 (0.165) MAX. 1.780 (0.070) MAX. 1.19 (0.047) MAX. 2.540 (0.100) BSC DIMENSIONS IN MILLIMETERS (INCHES). TOLERANCES (UNLESS OTHERWISE SPECIFIED): * REFER TO OPTION 300 DATA SHEET FOR MORE INFORMATION. xx.xx = 0.01 xx.xxx = 0.005 HP 7800 YYWW MOLDED LEAD COPLANARITY MAXIMUM: 0.102 (0.004) |
Podobny numer części - HCPL-7800 |
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Podobny opis - HCPL-7800 |
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