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LM2703 Arkusz danych(PDF) 3 Page - National Semiconductor (TI) |
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LM2703 Arkusz danych(HTML) 3 Page - National Semiconductor (TI) |
3 / 11 page Absolute Maximum Ratings (Note 1) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. V IN 7.5V SW Voltage 21V FB Voltage 2V SHDN Voltage 7.5V Maximum Junction Temp. T J (Note 2) 150˚C Lead Temperature (Soldering 10 sec.) 300˚C Vapor Phase (60 sec.) 215˚C Infrared (15 sec.) 220˚C ESD Ratings (Note 3) Human Body Model Machine Model (Note 4) 2kV 200V Operating Conditions Junction Temperature (Note 5) −40˚C to +125˚C Supply Voltage 2.2V to 7V SW Voltage Max. 20.5V Electrical Characteristics Specifications in standard type face are for T J = 25˚C and those in boldface type apply over the full Operating Temperature Range (T J = −40˚C to +125˚C). Unless otherwise specified. VIN =2.2V. Symbol Parameter Conditions Min (Note 5) Typ (Note 6) Max (Note 5) Units I Q Device Disabled FB = 1.3V 40 70 µA Device Enabled FB = 1.2V 235 300 Shutdown SHDN = 0V 0.01 2.5 V FB FeedbackTrip Point 1.189 1.237 1.269 V I CL Switch Current Limit 275 260 350 400 400 mA I B FB Pin Bias Current FB = 1.23V (Note 7) 30 120 nA V IN Input Voltage Range 2.2 7.0 V R DSON Switch R DSON 0.7 1.6 Ω T OFF Switch Off Time 400 ns I SD SHDN Pin Current SHDN = V IN,TJ = 25˚C 080 nA SHDN = V IN,TJ = 125˚C 15 SHDN = GND 0 I L Switch Leakage Current V SW = 20V 0.05 5 µA UVP Input Undervoltage Lockout ON/OFF Threshold 1.8 V V FB Hysteresis Feedback Hysteresis 8 mV SHDN Threshold SHDN low 0.7 0.3 V SHDN High 1.1 0.7 θ JA Thermal Resistance 220 ˚C/W Note 1: Absolute maximum ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions for which the device is intended to be functional, but device parameter specifications may not be guaranteed. For guaranteed specifications and test conditions, see the Electrical Characteristics. Note 2: The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction-to-ambient thermal resistance, θJA, and the ambient temperature, TA. See the Electrical Characteristics table for the thermal resistance. The maximum allowable power dissipation at any ambient temperature is calculated using: PD (MAX) = (TJ(MAX) −TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature. Note 3: The human body model is a 100 pF capacitor discharged through a 1.5 k Ω resistor into each pin. The machine model is a 200 pF capacitor discharged directly into each pin. Note 4: ESD susceptibility using the machine model is 150V for SW pin. Note 5: All limits guaranteed at room temperature (standard typeface) and at temperature extremes (bold typeface). All room temperature limits are 100% production tested or guaranteed through statistical analysis. All limits at temperature extremes are guaranteed via correlation using standard Statistical Quality Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL). Note 6: Typical numbers are at 25˚C and represent the most likely norm. Note 7: Feedback current flows into the pin. www.national.com 3 |
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