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ADS8681IPW Arkusz danych(PDF) 5 Page - Texas Instruments |
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ADS8681IPW Arkusz danych(HTML) 5 Page - Texas Instruments |
5 / 74 page 5 ADS8681, ADS8685, ADS8689 www.ti.com SBAS633B – FEBRUARY 2016 – REVISED DECEMBER 2016 Product Folder Links: ADS8681 ADS8685 ADS8689 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) AVDD = 5 V offers a low impedance of < 30 kΩ. (3) AVDD = floating with an impedance > 30 kΩ. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT AIN_P, AIN_GND to GND AVDD = 5 V(2) –20 20 V AVDD = floating(3) –11 11 AVDD to GND or DVDD to GND –0.3 7 V REFCAP to REFGND or REFIO to REFGND –0.3 5.7 V GND to REFGND –0.3 0.3 V Digital input pins to GND –0.3 DVDD + 0.3 V Digital output pins to GND –0.3 DVDD + 0.3 V Temperature Operating, TA –40 125 °C Storage, Tstg –65 150 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) Analog input pins (AIN_P, AIN_GND) ±4000 V All other pins ±2000 Charged device model (CDM), per JEDEC specification JESD22-C101(2) ±500 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT AVDD Analog supply voltage 4.75 5 5.25 V DVDD Digital supply voltage 1.65 3.3 AVDD V (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.4 Thermal Information THERMAL METRIC(1) ADS8681, ADS8685, ADS8689 UNIT PW (TSSOP) RUM (WQFN) 16 PINS 16 PINS RθJA Junction-to-ambient thermal resistance 95.7 31.9 °C/W RθJC(top) Junction-to-case (top) thermal resistance 29.3 27.9 °C/W RθJB Junction-to-board thermal resistance 41.5 7.4 °C/W ψJT Junction-to-top characterization parameter 1.5 0.3 °C/W ψJB Junction-to-board characterization parameter 40.8 7.4 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A 1.9 °C/W |
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