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ADA4937-2YCPZ-R7 Arkusz danych(PDF) 7 Page - Analog Devices

Numer części ADA4937-2YCPZ-R7
Szczegółowy opis  Ultralow Distortion Differential ADC Driver
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Producent  AD [Analog Devices]
Strona internetowa  http://www.analog.com
Logo AD - Analog Devices

ADA4937-2YCPZ-R7 Arkusz danych(HTML) 7 Page - Analog Devices

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Data Sheet
ADA4937-1/ADA4937-2
Rev. F | Page 7 of 28
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
Rating
Supply Voltage
5.5 V
Power Dissipation
See Figure 4
Storage Temperature Range
−65°C to +125°C
Operating Temperature Range
−40°C to +105°C
Lead Temperature (Soldering, 10 sec)
300°C
Junction Temperature
150°C
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
θJA is specified for the device (including exposed pad) soldered
to a high thermal conductivity 2s2p circuit board, as described
in EIA/JESD51-7.
Table 6. Thermal Resistance
Package Type
θJA
θJC
Unit
16-Lead LFCSP (Exposed Pad)
95
12.6
°C/W
24-Lead LFCSP (Exposed Pad)
67
8.78
°C/W
Maximum Power Dissipation
The maximum safe power dissipation in the ADA4937-1/
ADA4937-2 packages is limited by the associated rise in junction
temperature (TJ) on the die. At approximately 150°C, which is
the glass transition temperature, the plastic changes the properties.
Even temporarily exceeding this temperature limit can change
the stresses that the package exerts on the die, permanently
shifting the parametric performance of the ADA4937-1/
ADA4937-2. Exceeding a junction temperature of 150°C for
an extended period can result in changes in the silicon devices,
potentially causing failure.
The power dissipated in the package (PD) is the sum of the
quiescent power dissipation and the power dissipated in the
package due to the load drive. The quiescent power is the voltage
between the supply pins (VS) times the quiescent current (IS).
The power dissipated due to the load drive depends upon the
particular application. The power due to load drive is calculated
by multiplying the load current by the associated voltage drop
across the device. RMS voltages and currents must be used in
these calculations.
Airflow increases heat dissipation, effectively reducing θJA. In
addition, more metal directly in contact with the package
leads/exposed pad from metal traces, through holes, ground,
and power planes reduces θJA.
Figure 4 shows the maximum safe power dissipation in the
package vs. the ambient temperature for the ADA4937-1 single
16-lead LFCSP (95°C/W), and the ADA4937-2 dual 24-lead
LFCSP (67°C/W) on a JEDEC standard 4-layer board.
3.5
0
–40
110
90 100
AMBIENT TEMPERATURE (°C)
0.5
1.0
1.5
2.0
2.5
3.0
–30 –20 –10 0
10 20 30 40 50 60 70 80
ADA4937-2
ADA4937-1
Figure 4. Maximum Power Dissipation vs. Temperature, 4-Layer Board
ESD CAUTION


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