ADA4895-2ARMZ-R7 datasheet(7/24 Pages) AD

Numer części	ADA4895-2ARMZ-R7

Szczegółowy opis	Low Power, 1 nV/?숰z, G ??10 Stable, Railto- Rail Output Amplifier

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Data Sheet

ADA4895-1/ADA4895-2

ABSOLUTE MAXIMUM RATINGS

Table 5.

Parameter

Rating

Supply Voltage

11 V

Power Dissipation

See Figure 4

Common-Mode Input Voltage

−VS − 0.7 V to +VS + 0.7 V

Differential Input Voltage

±0.7 V

Storage Temperature Range

−65°C to +125°C

Operating Temperature Range

−40°C to +125°C

Lead Temperature (Soldering 10 sec)

300°C

Junction Temperature

150°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, θJA is specified

for a device soldered in a circuit board for surface-mount

packages. Table 6 lists the θJA for the ADA4895-1/ADA4895-2.

Table 6. Thermal Resistance

Package Type

θJA

Unit

8-Lead Single SOIC

133

°C/W

6-Lead Single SOT-23

150

°C/W

10-Lead Dual MSOP

210

°C/W

MAXIMUM POWER DISSIPATION

The maximum safe power dissipation for the ADA4895-1/

ADA4895-2 is limited by the associated rise in junction

temperature (TJ) on the die. At approximately 150°C, which is the

glass transition temperature, the properties of the plastic change.

Even temporarily exceeding this temperature limit can change

the stresses that the package exerts on the die, permanently

shifting the parametric performance of the ADA4895-1/

ADA4895-2. Exceeding a junction temperature of 175°C for an

extended period of time can result in changes in silicon devices,

potentially causing degradation or loss of functionality.

The power dissipated in the package (PD) is the sum of the

quiescent power dissipation and the power dissipated in the

die due to the ADA4895-1/ADA4895-2 drive at the output.

PD = Quiescent Power + (Total Drive Power − Load Power)

The quiescent power dissipation is the voltage between the supply

pins (±VS) multiplied by the quiescent current (IS).

(

)

L

OUT

L

OUT

S

D

R

V

R

V

I

V

P

2

−













×

+

×

=

Consider rms output voltages. If RL is referenced to −VS, as in

single-supply operation, the total drive power is VS × IOUT. In

single-supply operation with RL referenced to −VS, the worst

case is VOUT = VS/2.

If the rms signal levels are indeterminate, consider the worst case,

when VOUT = VS/4 with RL referenced to midsupply.

(

) ( )

L

S

D

R

V

I

V

P

2

4

/

+

×

=

Airflow increases heat dissipation, effectively reducing θJA. Also,

more metal directly in contact with the package leads reduces θJA.

Figure 4 shows the maximum safe power dissipation in the package

vs. the ambient temperature on a JEDEC standard, 4-layer board.

θJA values are approximations.

0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

–40

–30

–20

–10

0

10

20

30

40

50

60

70

80

90

100

110

120

AMBIENT TEMPERATURE (°C)

ADA4895-1 (SOIC)

ADA4895-1 (SOT-23)

ADA4895-2 (MSOP)

Figure 4. Maximum Power Dissipation vs. Temperature for a 4-Layer Board

ESD CAUTION

Rev. B | Page 7 of 24

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