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SS-BGA625A-01 Arkusz danych(PDF) 3 Page - Ironwood Electronics. |
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SS-BGA625A-01 Arkusz danych(HTML) 3 Page - Ironwood Electronics. |
3 / 5 page Compatible IC Spec 3 4 5 Dimensions are in millimeters. Interpret dimensions and tolerances per ASME Y14.5M-1994. Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. Datum Z (seating plane) is defined by the spherical crowns of the solder balls. Parallelism measurement shall exclude any effect of mark on top surface of package. 1. 2. DIM MIN MAX A 2.5 A1 0.5 0.7 b 0.90 D E e 32.50 BSC 32.50 BSC 1.27 BSC Array 25x25 D E Y X Ø0.25 Ø0.10 Z X Y Øb 3 TOP VIEW SIDE VIEW 0.20 BOTTOM VIEW e DETAIL 4 5 A A1 DETAIL 0.2 Z Z 0.20 Z PAGE 3 of 5 Status: Released Drawing: H. Hansen Scale: Rev: A Date: 2/8/06 Modified: File: SS-BGA625A-01 Dwg SS-BGA625A-01 Drawing © 2006 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com |
Podobny numer części - SS-BGA625A-01 |
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Podobny opis - SS-BGA625A-01 |
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