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SS-BGA324J-M-01 Arkusz danych(PDF) 2 Page - Ironwood Electronics. |
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SS-BGA324J-M-01 Arkusz danych(HTML) 2 Page - Ironwood Electronics. |
2 / 3 page A A1 DETAIL 0.2 Z Z 0.35 Z 5 4 0.25 Z PAGE 2 of 3 Status: Released Drawing: Jennifer Glab Scale: 3:1 Rev: A Modified: © 2006 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com SS-BGA324J-M-01 Drawing Date: 10/19/06 File: SS-BGA324J-M-01 Dwg D E Y X Ø0.25 Ø0.10 Z X Y Øb 3 TOP VIEW SIDE VIEW 3 4 5 Dimensions are in millimeters. Interpret dimensions and tolerances per ASME Y14.5M-1994. Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. Datum Z (seating plane) is defined by the spherical crowns of the solder balls. Parallelism measurement shall exclude any effect of mark on top surface of package. 1. 2. Compatible BGA Spec 0.20 BOTTOM VIEW DIM MIN MAX A 2.65 A1 0.3 0.6 b 0.7 D E e 23.00 BSC 23.00 BSC 1.0 BSC e DETAIL 22x22 Array |
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