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74LVC2G241DCUTE4 Arkusz danych(PDF) 1 Page - Texas Instruments

Numer części 74LVC2G241DCUTE4
Szczegółowy opis  DUAL BUFFER/DRIVER WITH 3-STATE OUTPUTS
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Producent  TI [Texas Instruments]
Strona internetowa  http://www.ti.com
Logo TI - Texas Instruments

74LVC2G241DCUTE4 Arkusz danych(HTML) 1 Page - Texas Instruments

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SN74LVC2G241
DUAL BUFFER/DRIVER
WITH 3STATE OUTPUTS
SCES210K − APRIL 1999 − REVISED OCTOBER 2003
1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
D Available in the Texas Instruments
NanoStar
 and NanoFree Packages
D Supports 5-V VCC Operation
D Inputs Accept Voltages to 5.5 V
D Max tpd of 4.1 ns at 3.3 V
D Low Power Consumption, 10-µA Max ICC
D ±24-mA Output Drive at 3.3 V
D Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C
D Typical VOHV (Output VOH Undershoot)
>2 V at VCC = 3.3 V, TA = 25°C
D Ioff Supports Partial-Power-Down Mode
Operation
D Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
D ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
description/ordering information
This dual buffer/line driver is designed for 1.65-V to 5.5-V VCC operation.
The SN74LVC2G241 is designed specifically to improve both the performance and density of 3-state
memory-address drivers, clock drivers, and bus-oriented receivers and transmitters.
ORDERING INFORMATION
TA
PACKAGE†
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING‡
NanoStar
 − WCSP (DSBGA)
0.17-mm Small Bump − YEA
SN74LVC2G241YEAR
NanoFree
 − WCSP (DSBGA)
0.17-mm Small Bump − YZA (Pb-free)
Reel of 3000
SN74LVC2G241YZAR
_ _ _C2_
−40
°C to 85°C
NanoStar
 − WCSP (DSBGA)
0.23-mm Large Bump − YEP
Reel of 3000
SN74LVC2G241YEPR
_ _ _C2_
−40
°C to 85°C
NanoFree
 − WCSP (DSBGA)
0.23-mm Large Bump − YZP (Pb-free)
SN74LVC2G241YZPR
SSOP − DCT
Reel of 3000
SN74LVC2G241DCTR
C41_ _ _
VSSOP − DCU
Reel of 3000
SN74LVC2G241DCUR
C41_
VSSOP − DCU
Reel of 250
SN74LVC2G241DCUT
C41_
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
‡ DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code,
and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition
(1 = SnPb,
= Pb-free).
Copyright
 2003, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar and NanoFree are trademarks of Texas Instruments.
DCT OR DCU PACKAGE
(TOP VIEW)
1
2
3
4
8
7
6
5
1OE
1A
2Y
GND
VCC
2OE
1Y
2A
4
3
2
1
5
6
7
8
GND
2Y
1A
1OE
2A
1Y
2OE
VCC
YEA, YEP, YZA, OR YZP PACKAGE
(BOTTOM VIEW)
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.


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