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BAL-NRF02D3 Arkusz danych(PDF) 6 Page - STMicroelectronics |
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BAL-NRF02D3 Arkusz danych(HTML) 6 Page - STMicroelectronics |
6 / 11 page Package information BAL-NRF02D3 6/11 DocID024794 Rev 6 3 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Epoxy meets UL94, V0 Lead-free package 3.1 Flip-Chip 5 bumps package information Figure 9: Flip-Chip 5 bumps package outline |
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